Modules and methods including magnetic sensing structures

ABSTRACT

A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.14/973,314, filed Dec. 17, 2015 and titled “DEVICES, SYSTEMS AND METHODSINCLUDING MAGNETIC STRUCTURES,” the disclosure of which is hereinincorporated by reference in its entirety.

BACKGROUND INFORMATION

Many applications utilize magnetic structures to perform sensing,actuation, and communication, etc. in devices such as integratedcircuits, sensors, and micromechanical devices, etc. Such devices mayinclude magnetic structures in place of or in addition to otherelements, such as electronic structures.

However, problems arise when integrating magnetic structures intovarious devices. Manufacturing materials having specific magneticproperties, such as producing a magnetic field or having electricalproperties that vary as a function of a magnetic field, typicallyinvolves specific requirements, such as related to temperature orcontaminants during the manufacturing process. These requirements oftenconflict with, or unduly restrain, the manufacturing of other materials,such as semiconductors, dielectric and metals, in the same device.

Devices including magnetic structures also typically require specificoperational conditions, such as related to the path of a magnetic field,which sometimes conflict with or unduly constrain operationalconditions, such as related to other electric, magnetic orelectro-magnetic fields, of other elements included in the same device.

Therefore, a need exists for magnetic devices, systems and correspondingmethods that integrate magnetic structures in an improved manner.

BRIEF DESCRIPTION OF THE DRAWINGS

So that features of the present invention may be understood, a number ofdrawings are described below. However, the appended drawings illustrateonly particular embodiments of the invention and are therefore not to beconsidered limiting of its scope, for the invention may encompass otherequally effective embodiments.

FIG. 1 is a schematic diagram depicting an embodiment of a magneticdevice.

FIGS. 2(a)-2(k) are top views depicting embodiments of a patterned layerof material having a selected magnetic property.

FIGS. 3(a)-3(c) are cross-sectional side views depicting embodiments ofa patterned layer of material.

FIGS. 4(a)-4(d) are perspective and cross-sectional side views depictingembodiments of a composite layer including a patterned layer ofmaterial.

FIGS. 5(a)-5(d) are cross-sectional side views depicting embodiments ofa patterned layer of material having a selected magnetic property.

FIGS. 6(a)-6(d) are top views depicting embodiments of a patterned layerof material.

FIG. 7 is a schematic diagram depicting an embodiment of the magneticdevice as a substrate-based magnetic device.

FIGS. 8(a)-8(d) are perspective views depicting embodiments of themagnetic device at stages of fabrication to form a magnetic structure ona substrate.

FIGS. 9(a)-9(c) are bottom views depicting embodiments of asemiconductor wafer at stages of fabrication to form a magneticstructure on the wafer.

FIGS. 10(a)-10(b) are perspective views depicting embodiments of amagnetic structure.

FIG. 11 is a perspective view depicting an embodiment of a magneticstructure on a substrate.

FIG. 12 is a top view depicting embodiments of a magnetic structure anda conductive coil.

FIG. 13 is a perspective view depicting an embodiment of a magneticdevice including a magnetic structure and a conductive coil on asubstrate.

FIGS. 14(a)-14(d) depict top, side and bottom views of an embodiment ofthe magnetic device including a magnetic structure and a conductive coilon a substrate.

FIG. 15 depicts a perspective view of an embodiment of a magneticstructure on a substrate.

FIGS. 16(a)-16(c) are cross-sectional side views depicting embodimentsof the magnetic device at stages of fabrication to form a magneticstructure on a substrate.

FIGS. 17(a)-17(b) are top and cross-sectional side views depicting anembodiment of the magnetic device including a magnetic flux concentratorand a magnetic sensor on a substrate.

FIGS. 18(a)-18(b) are top and cross-sectional side views depicting anembodiment of the magnetic device including a magnetic flux concentratorand a magnetic sensor on a substrate.

FIG. 19 is a circuit schematic depicting an embodiment of a magneticsensor.

FIGS. 20(a)-20(f) are cross-sectional side and top views depicting anembodiment of the magnetic device including a magnetic sensor having amagnetic shield on a substrate.

FIG. 21 is a side view depicting an embodiment of the magnetic deviceincluding a plurality of stacked magnetic structures.

FIGS. 22(a)-22(d) are perspective views depicting embodiments of themagnetic device at stages of fabrication to form a magnetic structure inone or more recesses on a substrate.

FIGS. 23(a)-23(d) are cross-sectional side views depicting embodimentsof the magnetic device at stages of fabrication to form a magneticstructure coating a plurality of recesses on a substrate.

FIGS. 24(a)-24(i) are perspective views depicting embodiments of themagnetic device at stages of fabrication to form a magnetic structureand conductive wiring in and about one or more recesses on a substrate.

FIGS. 25(a)-25(d) are cross-sectional side views depicting embodimentsof the magnetic device at stages of fabrication to form a magneticstructure in and about a recess on a substrate.

FIGS. 26(a)-26(d) are cross-sectional side views depicting embodimentsof the magnetic device at stages of fabrication to form a magneticstructure in and about a recess on a substrate.

FIGS. 27(a)-27(c) are cross-sectional top and side views depicting anembodiment of a magnetic structure on different levels of a substrate.

FIGS. 28(a)-28(b) are cross-sectional side views depicting embodimentsof a magnetic device including a magnetic flux concentrator and amagnetic sensor in and about a recess on a substrate.

FIG. 29 is a cross-sectional side view depicting embodiments of amagnetic structure in a recess on a back side of a substrate.

FIGS. 30(a)-30(b) are cross-sectional side and top views depicting anembodiment of a magnetic structure formed on an angled wall of a recesson a substrate.

FIGS. 31(a)-31(b) are cross-sectional side and top views depicting anembodiment of a magnetic structure formed on a plurality of angled wallsof a recess on a substrate.

FIG. 32 is a top view depicting embodiments of magnetic structuresformed on angled walls of a plurality of recesses on a substrate.

FIGS. 33(a)-33(d) are perspective and cross-sectional side viewsdepicting embodiments of the magnetic device including a magneticstructure on a cap on a substrate.

FIGS. 34(a)-34(b) are perspective and cross-sectional side viewsdepicting embodiments of the magnetic device including magneticstructures on and about a cap on a substrate.

FIG. 35 is a perspective view depicting an embodiment of the magneticdevice including a magnetic structure and a coil on a cap on asubstrate.

FIGS. 36(a)-36(b) are cross-sectional side views of embodiments of themagnetic device including magnetic sensors and a magnetic fluxconcentrator in, on and about a cap on a substrate.

FIGS. 37(a)-37(c) are cross-sectional side view of embodiments of themagnetic device including a magnetic structure including at least partof a micromechanical structure.

FIGS. 38(a)-38(b) are top views depicting embodiments of a magneticstructure including at least part of a plurality of micromechanicalstructures.

FIGS. 39(a)-39(b) are top and side views of an embodiment of a magneticstructure including at least part of a micromechanical structure.

FIG. 40 is a top view depicting an embodiment of a magnetic structureincluding at least part of a plurality of micromechanical structures.

FIGS. 41(a)-41(b) are cross-sectional side views of embodiments of amagnetic structure including at least part of a micromechanicalstructure.

FIGS. 42(a)-42(c) are cross-sectional side views of embodiments of amagnetic structure formed on a micromechanical structure.

FIGS. 43(a)-43(b) are top and bottom views of an embodiment of amagnetic structure formed on a micromechanical structure.

FIGS. 44(a)-44(c) are cross-sectional side views of an embodiment of amagnetic structure formed on a micromechanical structure.

FIG. 45 is a schematic diagram depicting an embodiment of the magneticdevice as a packaged magnetic device.

FIG. 46 is a cross-sectional side view depicting an embodiment of apackaged magnetic device.

FIGS. 47(a)-47(c) are cross-sectional side views depicting embodimentsof a packaged magnetic device.

FIG. 48 is a schematic diagram depicting an embodiment of the magneticdevice as a magnetic module.

FIG. 49(a)-49(d) are perspective and cross-sectional side viewsdepicting embodiments of a magnetic module.

FIGS. 50(a)-50(b) are exploded perspective and side views of a magneticstructure aligned to apertures in a plurality of substrates.

FIGS. 51(a)-51(d) are perspective and cross-sectional side viewsdepicting embodiments of a magnetic module including magnetic structuresaligned to apertures in a plurality of substrates.

FIGS. 52(a)-52(c) are cross-sectional side views depicting embodimentsof a magnetic structure formed about a fluid channel and a magneticdevice including a magnetic structure formed about a fluid channel.

FIG. 53 is a schematic diagram depicting an embodiment of the magneticdevice as or as part of a magnetic system.

FIGS. 54(a)-54(b) are exploded perspective and perspective viewsdepicting embodiments of magnetic structures.

FIGS. 55(a)-55(b) are exploded perspective and perspective viewsdepicting embodiments of magnetic structures.

FIG. 56 is a circuit schematic depicting an embodiment of a magneticstructure and a circuit to receive and process signals from the magneticstructure.

FIG. 57 is a circuit schematic depicting an embodiment of a magneticstructure and a circuit to generate and provide electrical signals tothe magnetic structure.

FIG. 58 is a circuit schematic depicting an embodiment of a circuit togenerate and provide electrical signals to a conductive coil.

FIG. 59 is a circuit schematic depicting an embodiment of a magneticstructure and a circuit to transmit a signal based on electrical signalsfrom the magnetic structure.

FIG. 60 is a circuit schematic depicting an embodiment of a magneticsensor and an amplification circuit to provide an output representing amagnetic field sensed by the magnetic sensor.

FIG. 61 is a circuit schematic depicting an embodiment of a magneticsensor and an amplification circuit to provide an output representing amagnetic field sensed by the magnetic sensor.

FIG. 62 is a circuit schematic depicting an embodiment of a magneticsensor and an amplification circuit to provide an output representing amagnetic field sensed by the magnetic sensor.

FIG. 63 is a circuit schematic depicting an embodiment of a magneticsensor and an amplification circuit to provide an output representing amagnetic field sensed by the magnetic sensor.

FIG. 64 is a circuit schematic depicting an embodiment of a magneticsensor and an amplification circuit to provide an output representing amagnetic field sensed by the magnetic sensor.

FIG. 65 is a circuit schematic depicting an embodiment of a magneticsensor and a driver circuit that may be used to drive the magneticsensor.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Embodiments of a magnetic device may incorporate a magnetic structure inan improved manner to provide one or more of improved device areautilization, manufacturability, reliability, performance or cost. Themagnetic device may include the magnetic structure, another devicestructure, and an associated circuit.

The magnetic structure may interact magnetically with the environment ofthe magnetic device. The magnetic structure may include a layer ofmaterial that has a selected magnetic property such as producing amagnetic field or being responsive to a magnetic field. The layer may bepatterned to provide one or more separate layer portions having selectedshapes, and may be combined with other layers, to provide the selectedmagnetic properties. The magnetic structure may provide functionalitiessuch as magnetic sensing, magnetic flux channeling, magnetic fluxconcentrating, magnetic shielding, magnetically actuated motion, etc.

The device structure may be another structure of the device that isphysically connected to or arranged relative to the magnetic structurein a predetermined manner to, for example, structurally support, enablethe operation of, or more advantageously integrate into the magneticdevice the magnetic structure. The device structure may include, forexample, a substrate, a layer on the substrate, a recess or aperture inthe substrate, or a cap on the substrate, etc. The device structure alsomay optionally interact with the magnetic structure and/or environmentof the magnetic device. For example, the device structure may include aconductive coil to generate a magnetic field. The device structure alsomay include package and module elements.

The associated circuit may be electrically connected to one or both ofthe magnetic structure and other device structure to provide functionssuch as, for example, receiving, providing, conditioning or processingof signals of the magnetic device. The circuit may include one or moreof an amplification circuit, an analog-to-digital converter, adigital-to-analog converter, a driver circuit, a processor, acontroller, etc. The circuit may be integrated with the magneticstructure on the same substrate or provided on another substrate. Thecircuit also may be provided as separate components in a device such asa packaged device or module.

FIG. 1 depicts an embodiment of a magnetic device 20 that incorporates amagnetic structure 24 in an improved manner to provide one or more ofimproved device area utilization, manufacturability, reliability,performance or cost. The magnetic device 20 may include the magneticstructure 24, another device structure 28, and an associated circuit 32.The magnetic structure 24 may interact magnetically 25 with theenvironment of the magnetic device 20. The device structure 28 may beanother structure of the device 20 that is physically connected to orarranged relative to the magnetic structure 24 in a predeterminedmanner. The device structure 28 also may optionally interact 29 with theenvironment of the magnetic device 20. The associated circuit 32 may beelectrically connected 27, 31 to one or both of the magnetic structure24 and other device structure 28 to provide one or more functions suchas providing, receiving, conditioning or processing of signals. Thecircuit 32 also may be electrically connected 33 external to themagnetic device to receiving or provide data to or from the magneticdevice.

The magnetic structure may include a layer of material with a selectedmagnetic property, such as producing a magnetic field or producing aresponse to a magnetic field.

For example, the material may produce a temporary or permanent magneticfield. Materials that produce a temporary magnetic field may be referredto as soft magnetic materials, and materials that produce a permanentmagnetic field may be referred to as hard magnetic materials. Softmagnetic materials may include, e.g., ferromagnetic material,ferrimagnetic material, etc. Ferromagnetic materials may include, e.g.,iron, nickel, cobalt, gadolinium, etc. Ferrimagnetic materials mayinclude, e.g., ferrites of manganese, copper, nickel, iron, etc. Hardmagnetic materials may include Alnico, SmCo, NdFeB, etc.

The material may have a selected permeability to magnetic fields, suchas a permeability above a predetermined threshold. Magnetic materialsthat have a selected permeability to magnetic fields, such as apermeability above a predetermined threshold, may include soft magneticmaterials, etc.

The material may produce a response to a magnetic field by having anelectrical property that varies as a function of the magnetic fieldexperienced by the material. Such a material may include amagnetoresistive material having an electrical resistance that varies asa function of the magnetic field. Magnetoresistive materials mayinclude, e.g., anisotropic magnetoresistive material, colossalmagnetoresistive material, etc. Anisotropic magnetoresistive materialsmay include, e.g., nickel iron, etc. Colossal magnetoresistive materialsmay include, e.g., manganese perovskite oxides, etc. One or more layersof magnetoresistive material also may be arranged with one or morelayers of other material to form a composite magnetoresistive structure.Such a composite magnetoresistive structure may include, e.g., a giantmagnetoresistance structure, a tunnel magnetoresistance structure, etc.

The magnetic structure of any of the embodiments of the magnetic devicediscussed herein may include a material having any of the magneticproperties discussed herein, such as any of producing a magnetic fieldor producing a response to a magnetic field as discussed herein, amongother properties. In some embodiments, the magnetic device may provideselected functionality by specifically utilizing materials havingcertain selected magnetic properties.

The layer of material may be patterned to impart a perimeter, boundaryor shape to the layer to provide specific magnetic properties of themagnetic structure. The specific magnetic properties may include theability to produce or respond to magnetic fields along specific spatialdirections or orientations.

FIGS. 2(a)-2(k) depict top views of layers patterned to provide selectedperimeters, boundaries or shapes. FIGS. 2(a)-2(c) depict embodiments ofpatterned layers having a cross-shaped, circular, and square orrectangular shapes 40, 44, 48, respectively. FIGS. 2(d)-2(e) depictembodiments of patterned layers having a plurality of separaterectangular, square or linear portions 52, 56 arranged in a pattern orarray, such as with subsets of the portions arranged facing each, as inFIG. 2(d), or in an array with a characteristic spacing between them, asin FIG. 2(e). FIGS. 2(f)-2(g) depict embodiments of patterned layershaving a plurality of separate portions forming concentric rings 60, asin FIG. 2(f), or strips 64 outlining rectangular or square shapes withaligned centers, as in FIG. 2(g). FIGS. 2(g)-2(h) depict embodiment ofpatterned layers having a plurality of separate arcuate segments 68arranged to outline a ring, as in FIG. 2(g), or a plurality of L- orT-shaped segments 72 arranged to outline a square or rectangle, as inFIG. 2(h). FIG. 2(j) depicts an embodiment of a patterned layer having aplurality of linear portions 76 connected together to form a singleintegral segment following a back and forth path. FIG. 2(k) depicts anembodiment of a patterned layer having a spiral shape 80.

Additional embodiments of the patterned layer may include otherarrangements of one or more layer portions. The patterned layer ofmaterial may include arrangements of a plurality of any of the exemplaryshapes depicted in FIGS. 2(a)-2(k) or other shapes. For example, thepatterned layer may include a plurality of shapes arranged in one or twodimensional arrays with characteristic periodic spacing betweeninstances of the shapes in the one or two dimensions. Additionalembodiments may include only a single ring or strip of the shapes inFIGS. 2(f)-2(g); one or more arcuate, T-shaped or L-shaped sectionsshown in FIGS. 2(h)-2(i) in different arrangements; or a plurality oflinear or other segments similar to those in FIGS. 2(e) and 2(j)connected to follow a different path.

The patterned layer of material also may have a selected heightcharacteristic perpendicular to a plane in which the perimeter, boundaryor shape of the layer is defined. The selected height characteristic mayprovide specific magnetic properties of the magnetic structure, such asthe ability to produce or respond to magnetic fields along specificspatial directions or orientations.

FIGS. 3(a)-3(c) depict cross-sectional side views of embodiments ofpatterned layers having selected height characteristics perpendicular toa plane in which the perimeter, boundary or shape of the layer isdefined. The depicted cross-sections may represent a slice of thepatterned layer taken along an axis parallel to the plane in which theperimeter, boundary or shape of the layer is defined, such as along theaxes A-A or B-B depicted in FIGS. 2(c) and 2(e), or along other axes inother directions in the planes of the shapes of FIGS. 2(a)-2(k). FIG.3(a) depicts an embodiment of the patterned layer having a substantiallyconstant height 81 in the direction perpendicular to the plane definingthe shape of the layer along an axis 82 parallel to the plane definingthe shape. A substantially constant height may provide substantiallyconstant magnetic properties of the patterned layer along the axis.

FIGS. 3(b)-3(c) depict embodiments of the patterned layer having aheight in the direction perpendicular to the plane defining the shape ofthe layer that vary along axes parallel to the plane defining the shape.In FIG. 3(b), the patterned layer may have a height varying fromsubstantially zero to a predetermined height 83, and in FIG. 3(c), thepatterned layer may have a height varying from a first predeterminedheight 86 to a second predetermined height 87 different than the firstpredetermined height. The height of the patterned layer also may varyaccording to a selected function of the distance along the axes 85, 89.In FIGS. 3(b)-3(c), the height may vary as a linear function of thedistance along the axes 85, 89. In other embodiments, the height mayvary according to other functions of the distance along the axis 85, 89,such as non-linear functions, stepped functions, etc. A varying heightmay provide correspondingly varying magnetic properties of the patternedlayer along the axis. For example, embodiments of a varying height maybe used to produce or respond to magnetic fields along the axis toprovide position detection or current sensing of an object along theaxis.

The patterned layer of material may be formed in an integral manner withone or more other layers to form a composite layer. FIGS. 4(a)-4(b)depict perspective and cross-sectional side views, respectively, of anembodiment of a patterned layer of material formed in an integral mannerwith another layer of material. The patterned layer of material mayinclude a plurality of separate portions 84 embedded in the othermaterial 88 so that the other material 88 occupies spaces between theseparate portions 84 of the magnetic layer. The patterned layer ofmaterial may optionally include a first set of surfaces 92 exposed at afirst surface or boundary of the composite layer, and a second set ofsurfaces 96 covered by the other material 88 within the composite layer.The other layer of material 88 may be a material having a selectedmagnetic property or another type of material.

The composite layer may provide specific magnetic, electric orstructural properties. In embodiments in which the second material 88 isalso a material having a selected magnetic property, the second material88 may alter, such as increase, decrease, or otherwise set, the magneticproperties of the patterned layer of material 84 to provide specificmagnetic properties of the composite layer. In embodiments in which thesecond material 88 is another type of material, the second material 88also may alter the magnetic properties of the patterned layer ofmaterial 84 to provide specific magnetic properties of the compositelayer, or may alternatively provide structural or electrical propertiesto the composite layer.

The embedded portions of the patterned layer also may have a selectedcross-sectional area. In FIGS. 4(a)-4(b), the embedded portions may havea rounded or semi-circular cross-sectional area. In other embodiments,the embedded portions may have other cross-sectional areas, such as oneor more of square, rectangular, or trapezoidal cross-sectional areas,etc.

The cross-sectional area of the embedded portion also may have aselected constancy along axes. In FIGS. 4(a)-4(b), the embedded portionsmay have a substantially constant cross-sectional area along alongitudinal axis 94 to which the portions are aligned. FIG. 4(c)depicts a cross-sectional top view of another embodiment of a compositelayer in which the embedded portions may have a cross-sectional areahaving a width 95 that changes along a longitudinal axis 97 in apredetermined manner, such as in a linear manner. FIG. 4(d) depicts across-sectional side view of another embodiment of a composite layer inwhich the embedded portions may have a cross-sectional area having aheight 99 that changes along a longitudinal axis 101 in a predeterminedmanner, such as in a linear manner.

The layer of material having the selected magnetic property may includea surface with a selected topography. The selected topography mayprovide specific magnetic, electric or structural properties to thelayer. FIG. 5(a) depicts a cross-sectional view of a layer of material102 having a top surface 100 with a plurality of projections 104 andrecesses 108. The plurality of projections 104 may be formed in an arrayhaving a characteristic periodic spacing between them, as may be theplurality of recesses 108. The projections 104 and recesses 108 may beinterleaved with each other. The layer of material with the selectedtopography also may be formed in an integral manner with one or moreadditional layers to form a composite layer, as discussed above. FIGS.5(b)-5(d) depict cross-sectional views of a patterned layer of materialhaving a selected topography formed in an integral manner with anotherlayer of material. In FIG. 5(b), the projections 104 of the patternedlayer 102 may include portions 116 exposed above a top surface 120 ofthe second layer of material 118. In FIG. 5(c), the projections 104 ofthe patterned layer 102 and the top surface 128 of the second layer ofmaterial 124 may be located at substantially the same level. In FIG.5(d), the second layer of material 132 may completely enclose theprojections 104 of the patterned layer.

The layer of material having the selected magnetic property may includea plurality of separate portions having magnetic polarities alignedaccording to a selected configuration to provide specific magneticproperties. FIGS. 6(a)-6(d) depict top views of embodiments of patternedlayers including a plurality of separate portions with aligned magneticpolarities. FIG. 6(a) depicts an embodiment of a patterned layerincluding a plurality of separate portions 136 arranged in a twodimensional array, each of the separate portions 136 having magneticpole axis aligned in a same direction. FIGS. 6(b)-6(c) depictembodiments of a patterned layer including a first plurality of separateportions 140, 148 arranged in an array, each having magnetic pole axisaligned in a same first direction, and a second plurality of separateportions 144, 152 also arranged in an array, each having magnetic poleaxis aligned in a same second direction, the first and second directionsbeing perpendicular to each other. FIG. 6(d) depicts an embodiment of apatterned layer including first and second pluralities of separateportions 156, 160 having magnetic pole axes respectively aligned infirst and second perpendicular directions, and third and fourth separateportions 164, 168 having magnetic pole axes respectively aligned inthird and fourth perpendicular directions.

The magnetic structure of any of the embodiments of the magnetic devicediscussed herein may include a patterned layer having any of theproperties of patterned layers discussed herein, such as any of theproperties of patterned layers discussed in regard to any of FIGS. 2-6and their various subfigures (i.e., (a), (b), etc.), among otherproperties.

The magnetic structure may be incorporated into the magnetic device inpart through its physical connection or arrangement relative to anotherstructure of the magnetic device in a predetermined manner to one ormore of structurally support, enable the operation of, or otherwiseintegrate into the magnetic device the magnetic structure.

The magnetic structure may be connected to or arranged relative to astructure of a substrate. FIG. 7 depicts an embodiment of the magneticdevice 161 as a substrate-based magnetic device having a magneticstructure connected or arranged relative to a structure of a substrate.The magnetic device 161 may include one or more substrates 167, amagnetic structure 163, and an associated circuit 169.

The substrate may include one or more substrate structures 165, such asone or more of a surface, a recess, a side, etc. The magnetic structuremay be physically connected or arranged relative to the one or moresubstrate structures in a predetermined manner.

The magnetic device also may optionally include one or more otherstructures 171, such as a coil, cap, micromechanical structure, antenna,etc. The magnetic structure may be physically connected to or arrangedrelative to the other structure in a predetermined manner.

The circuit may be electrically connected to one or both of the magneticstructure and the other device structure to provide, receive, conditionor process etc. signals of the magnetic structure or other devicestructure. The circuit also may provide or receive electrical signalsexternal to the magnetic device, such as one or more of receiving datafor controlling a component of the magnetic device, such as to provide amagnetic field to set or change a magnetic field in the magneticstructure, or to transmit data from a component of the magnetic device,such as to transmit data based on an electrical signal produced by themagnetic structure.

The substrate may include a semiconductor. For example, the substratemay be a semiconductor substrate such as utilized to manufactureintegrated circuits. In some such embodiments, the magnetic device maybe part of an integrated circuit. The substrate alternatively or inaddition may include other types of materials, such as one or more of aninsulator, glass, ceramic, etc. For example, the substrate may includean insulator such as utilized to manufacture silicon-on-insulatorcircuits, a glass such as utilized to manufacture displays and otherdevices, or a ceramic such as utilized to manufacture hybrid circuits.

The magnetic device may include a single substrate on or about which themagnetic structure and the circuit are formed. For example, in oneembodiment, the magnetic device may be a single integrated circuitincluding both the magnetic structure and the associated circuit.Alternatively, the magnetic device may include more than one substrate.For example, the magnetic device may include a first substrate 167 a onor about which the magnetic structure is formed and a second substrate167 b on or about which the circuit is formed.

Any of the embodiments of the magnetic device discussed herein mayinclude one or more substrates according to any of the embodiments ofthe substrate discussed herein.

The magnetic structure may include a patterned layer of material havinga selected magnetic property formed on a substrate in a predeterminedmanner in relation to other circuits that may be formed on thesubstrate. In embodiments, the patterned layer may be formed on one ormore areas of the substrate without active circuits. FIGS. 8(a)-8(b)depict embodiments of a magnetic device at a first stage of a method offabricating the magnetic device, after a substrate 172, 174 is providedthat includes one or more areas 176, 178 without active circuits and oneor more areas 180, 182 with or for which active circuits are planned.Active circuits may include powered integrated circuit devices such astransistors. The one or more areas 176, 178 without active circuits mayhave the same shape as or encompass shapes of the patterned layer ofmaterial. The substrate 172, 174 may be processed to produce the one ormore areas 176, 178 without active circuits, such as by removing layerson top of the substrate or otherwise conditioning the area to moreeffectively receive the patterned layer of material. FIGS. 8(c)-8(d)depict embodiments of the magnetic device at a second stage of themethod of fabrication, in which the patterned layer of material 186, 188has been formed on the substrates in FIGS. 8(a)-8(b) in the one or moreareas without active circuits. The layer 186, 188 may assume variousshapes as discussed above. The layer 186, 188 may be formed in the areaswithout active circuits at a separate time as the active circuits, in aseparate processing apparatus, or both, to prevent or reducecross-contamination of the magnetic material with materials of theactive circuits.

In other embodiments, the patterned layer may be formed in a same areaon the substrate as active circuits. For example, the patterned layermay be formed as a layer above or below a one or more layers containingactive circuits formed on the substrate.

The patterned layer also may be formed on a back side of a substrate.The back side of the substrate may exclude include active circuits. Thepatterned layer may be formed on the back side of a substrate wafersimultaneously for a plurality of integrated circuits or other substratedevices. FIG. 9(a) depicts an embodiment of a bottom view of asemiconductor wafer 192 from which a plurality of integrated circuits orother substrate devices may ultimately be separated after processing.FIG. 9(b) depicts an embodiment of a bottom view of the wafer of FIG.9(a) at a stage of fabrication after a layer of material 196 having aselected magnetic property has been formed across substantially theentire back surface of the wafer. FIG. 9(c) depicts an embodiment of abottom view of the wafer of FIGS. 9(a)-9(b) at a further stage offabrication, after the layer has been patterned to form patterned layershapes 200 on the back side of the wafer for each of a plurality ofintegrated circuits or other substrate devices into which the wafer maybe separated.

The magnetic structure may be formed as a separate structure that may beattached to a substrate. FIG. 10(a) depicts an embodiment of a patternedlayer 204 formed as a separate structure. The separate structure may beformed by one or more of punching, casting, plating, rolling, ordepositing, etc. the magnetic layer into the separate structure. Thelayer also may be formed on a corresponding substrate as a separatestructure. FIG. 10(b) depicts an embodiment of a patterned layer 208formed on a corresponding substrate 212 as a separate structure. Thesubstrate 212 may have the same or a corresponding boundary or shape asthe layer 208. The substrate 212 also may provide structural support forthe layer 208, as well as facilitate fabrication of the layer 208.

The magnetic device may include the separate magnetic structure attachedto a substrate. FIG. 11 depicts an embodiment of the magnetic devicethat may include the separate magnetic structure attached to a substrate216.

The magnetic structure also may be physically connected to or arrangedrelative to other device structures. In embodiments, the other devicestructure may be a conductive coil. The magnetic structure may belocated relative to the conductive coil in a predetermined manner toprovide one or more of magnetic, electrical or structural interactionbetween the magnetic structure and conductive coil. For example, theconductive coil may be operated to provide a magnetic field to set orchange a magnetic field in the magnetic structure. The conductive coilalso may operate as a transmitter to communicate data based on anelectrical signal produced by the magnetic structure, such as totransmit data representing a magnetic field or current sensed by themagnetic structure.

FIG. 12 depicts a top view of embodiments of the magnetic structure 220and conductive coil 224. The magnetic structure 220 may be located in apredetermined manner with respect to a portion 228 of the conductivecoil 224. For example, the magnetic structure 220 may be located aboveor below a section 228 of the conductive coil 224. The section 228 ofthe conductive coil 224 may include a plurality of conductive segments232 232 with current flowing in substantially a same direction. Theconductive coil 224 may include a layer of conductive material, such asmetal, formed into a pattern, such as spiral or other coiling pattern,to produce sections having a plurality of conductive segments withcurrent flowing in substantially a same direction.

The magnetic device may include the magnetic structure and conductivecoil incorporated onto a same side of a substrate such as semiconductoror other substrate. FIG. 13 depicts an embodiment of the magnetic devicethat may include the magnetic structure 220 and conductive coil 224formed on a first side of a substrate 236.

The magnetic structure and conductive coil also may be incorporated ontodifferent areas or sides of a substrate. FIGS. 14(a)-14(c) depictanother embodiment of the magnetic device incorporating the magneticstructure 240 and conductive coil 244 onto opposite sides of a substrate248. FIG. 14(a) depicts a top view of the magnetic device, showing theconductive coil 244 formed as a layer on a first side of a substrate248. FIG. 14(c) depicts a bottom view of the magnetic device, showingthe magnetic structure 240 formed as a patterned layer on a second sideof the substrate 248. FIG. 14(b) depicts a side cross-sectional view ofthe magnetic device, showing the conductive coil 244 as the layer on thefirst side of a substrate 248 and the magnetic layer 240 on the secondside of the substrate 248. The substrate 248 may optionally also includeareas including active circuitry 252, such as on either the first orsecond side of the substrate. In FIG. 14(c), an area including activecircuitry 252 may be included on the second side of the substrate 248 ina separate area from that including the magnetic layer 240.

The conductive coil may optionally be formed as plurality of layers.FIG. 14(d) depicts a side cross-sectional view of another embodiment ofthe magnetic device similar to that of FIGS. 14(a)-14(c), but showingthe conductive coil 256 formed as a plurality of layers extending fromthe first side of a substrate 260 to the second side of the substrate260.

Embodiments in which the magnetic structure is located above or below asection of the conductive coil, such as those of, e.g., FIGS. 12, 13 and14(a)-14(d), may be useful for operation to provide a magnetic field toset or change a magnetic field in the magnetic structure. Embodiments inwhich the magnetic structure may be located in a different area ordifferent side of the substrate from the conductive coil, such as thoseof, e.g., FIGS. 14(a)-14(d), and 34 (discussed below), may be useful foroperation of the conductive coil as a transmitter to communicate databased on an electrical signal produced by the magnetic structure.Alternatively, the magnetic device may include a structure and/orcircuit other than a conductive coil to operate as a transmitter tocommunicate data based on an electrical signal produced by the magneticstructure, such as one or more of an antenna, a transmitter circuit,etc.

The magnetic device may incorporate the magnetic structure in thepredetermined manner so that it is physically aligned with an aperturein a device structure such as a substrate structure or other devicestructure. FIG. 15 depicts an embodiment of a magnetic device having apatterned layer 264 formed on a substrate 268. Each of the patternedlayer 264 and substrate 268 may include an aperture 272, 274 extendingfrom a top surface of the layer 264 or substrate 268 to a bottom surfaceof the layer 264 or substrate 268. Furthermore, the patterned layer 264may be positioned relative to the substrate 268 so that the aperture 272in the patterned layer 264 aligns with the aperture 274 in the substrate268. The alignment of the apertures 272, 274 may create a path of travelfor another component or device through the apertures 272, 274 from oneside of the magnetic device to the other.

The alignment of the apertures in the magnetic structure and anotherdevice structure may be achieved as a result of a fabrication processfor the magnetic device. FIGS. 16(a)-16(c) depict embodiments of themagnetic device at various stages of a method of fabricating themagnetic device. FIG. 16(a) depicts a cross-sectional side view of anembodiment of the magnetic device at a first stage of the method, afterthe substrate 268 is provided. FIG. 16(b) depicts a cross-sectional sideview of the magnetic device at a second stage of the method, after thepatterned layer 264 is formed on the substrate 268. The patterned layer264 may be formed in different ways, such as by one or more ofdepositing, plating, or growing, etc. the patterned layer. FIG. 16(c)depicts a cross-sectional side view of an embodiment of the magneticdevice at a third stage of the method, after the aperture 272, 274 isformed through the patterned layer 264 and the substrate 268. Theaperture 272, 274 may be formed in both the patterned layer 264 andsubstrate 268 by the same process, such as by one or more of etching,drilling, or otherwise removing material to form the aperture. Formingthe aperture 272, 274 through both the patterned layer 264 and thesubstrate 268 using the same process may provide both an efficientmethod of forming the aperture 272, 274 and an accurate alignment of theapertures 272, 274 in the patterned layer 264 and the substrate 268.

The magnetic device also may include one or more magnetic structuresarranged relative to each other to provide selected magnetic and otherfunctionalities. In embodiments, the magnetic device may include one ormore magnetic structures arranged to provide a magnetic fluxconcentrator to selectively channel or concentrate magnetic flux. Such amagnetic structure may include one or more patterned layers having aplurality of separate portions with different distributions of materialhaving selected magnetic properties to selectively channel orconcentrate magnetic flux. For example, the magnetic structure mayinclude one or more patterned layers to channel or concentrate magneticflux from a first flux concentration at a first flux surface to a secondflux concentration different than the first flux concentration at asecond flux surface, the second flux surface having a differentdistribution or area than the first flux surface.

FIG. 17(a) depicts a top view of an embodiment of a magnetic deviceconfigured to provide a magnetic flux concentrator, and FIG. 17(b)depicts a cross-sectional side view of the embodiment of the magneticdevice taken along the axis in FIG. 17(a). The magnetic device mayinclude a magnetic flux concentrator 278, a magnetic sensor 282, and asubstrate 286. The magnetic flux concentrator 278 may include aplurality of patterned layers having one or more of differentdistributions of material having selected magnetic properties along aselected dimension, or different flux surface areas. A first patternedlayer 290 may include an outer concentric ring and a second patternedlayer 294 may include an inner concentric ring. The outer concentricring may be formed on the substrate 286 to a first height, and the innerconcentric ring may be formed on the substrate 286 to a second heightless than the first height. As a result, the outer concentric ring mayhave a different material distribution in the vertical direction anddifferent flux surface areas than the inner concentric ring. Thematerial of the patterned layers of the magnetic flux concentrator maybe a material having a relatively high permeability to magnetic fields,such as permeability above a predetermined threshold.

The magnetic sensor 282 also may include a magnetic structure includinga patterned layer of material 298. The patterned layer of material 298of the magnetic sensor 282 may formed on the substrate 286 at locationsbetween the first and second patterned layers 290, 294. The magneticsensor 282 also may include electrical interconnections and othercomponents as discussed below. The material of the magnetic sensor maybe a magnetoresistive material.

In operation, the magnetic flux concentrator 278 of FIGS. 17(a)-17(b)may channel and/or concentrate the magnetic flux of a magnetic field inthe environment of the magnetic device in a predetermined manner so thatthe magnetic flux passes through the magnetic sensor 282 in a selecteddirection and at a selected concentration. FIG. 17(b) shows an exemplarypath of magnetic flux 302 in the space about and through the magneticdevice. Above and below the magnetic device, the magnetic flux may beoriented in substantially the vertical direction. As the magnetic fluxpasses through the magnetic flux concentrator 278, it may deviate alongthe depicted path as a result of the relative arrangement of thepatterned layers 290, 294, which may provide a preferential path formagnetic flux as a function of their magnetic properties. This mayresult in the magnetic flux bending to take a substantially or at leastmore horizontal path as it passes through the magnetic sensor 282.Channeling and/or concentrating of the magnetic flux along a selecteddirection may provide a number of advantages, including one or more ofenabling the magnetic sensor 282 to be configured to have an operationalsensitivity to magnetic fields along the horizontal direction instead ofthe vertical direction, which may be advantageous for fabrication of thesensor 282, and enabling configurations of a magnetic device that maysense both vertical and horizontal magnetic fields using similar sensorarrangements.

Embodiments of the magnetic device to provide a magnetic fluxconcentrator may include magnetic structures having patterned layersincluding other shapes. A magnetic device similar to that of FIGS.17(a)-17(b) may include a magnetic flux concentrator and a magneticsensor each having a respective patterned layer including any of theshapes depicted in FIGS. 2(a)-2(k). For example, the magnetic fluxconcentrator may include a partnered layer having first and secondaligned rectangles such as depicted in FIG. 2(g), segmented concentricrings or aligned squares similar to as depicted in FIGS. 2(h) and 2(i),etc.

Embodiments of the magnetic device to provide a magnetic fluxconcentrator also may include magnetic structures having patternedlayers including varying heights. A magnetic device similar to that ofFIGS. 17(a)-17(b) may include one or more of a magnetic fluxconcentrator or a magnetic sensor having a height in the verticaldirection in FIGS. 17(a)-17(b) that varies along the horizontaldirection in FIGS. 17(a)-17(b), such as depicted in FIGS. 3(b)-3(c). Forexample, the magnetic flux concentrator may include a patterned layerhaving an outer portion having a height that varies between a firstheight at a first location, such as at the outermost location of theouter portion, and a second height less than the first height at asecond location, such as at the innermost location of the outer portion.Similarly, the magnetic sensor also may include a patterned layer havinga height that varies between a first height at a first location and asecond height different than the first height at a second location.

The magnetic device may provide still other embodiments of a magneticflux concentrator to selectively channel or concentrate magnetic fluxalong different paths. FIGS. 18(a)-18(b) depict top and sidecross-sectional views of an embodiment of a magnetic device includingmagnetic structures providing another magnetic flux concentrator 306.The magnetic device may include a first magnetic structure and a secondmagnetic structure formed on a substrate 310 or a layer on a substrate.The first magnetic structure may include a first patterned layer ofmaterial 314 including one or more separate segments providing amagnetic flux concentrator 306 to concentrate or channel magnetic fluxfor the second magnetic structure. The second magnetic structure mayprovide a magnetic sensor 318. The material of the magnetic fluxconcentrator may be a material having a relatively high permeability tomagnetic fields, such as a permeability above a predetermined threshold,and material of the magnetic sensor may be a magnetoresistive material.

The first patterned layer 314 may provide magnetic flux channeling orconcentration by providing a decreasing surface area for the magneticflux travel. For example, the first patterned layer may include asegment 322 providing a channeling or concentrating of magnetic fluxfrom a first flux concentration at a flux entry area 326 to a secondflux concentration larger than the first flux concentration at a fluxexit area 332 smaller than the flux entry area. The first patternedlayer also may include a segment 336 providing a channeling orconcentrating of magnetic flux from a third flux concentration at a fluxentry area 340 to a fourth flux concentration smaller than the thirdflux concentration at a flux exit area 344 larger than the flux entryarea.

In other embodiments, the magnetic device may provide yet furtherconfigurations of magnetic flux concentrators. For example, the magneticdevice may include a magnetic structure similar to those discussed abovein regard to FIGS. 17(a)-17(b) or 18(a)-18(b), but arranged to channelor concentrate magnetic flux as it travels in various different selecteddirections, such as in one or more of between different concentrationsin a single direction, such as a vertical direction, a horizontaldirection, or another direction; or as it changes direction from firstdirection to a second direction, such as a change in direction from ahorizontal to vertical direction, from a vertical to a horizontaldirection, or from any first predetermined direction to any seconddifferent predetermined direction.

In the above and other embodiments, the magnetic device may include amagnetic structure arranged to operate as a magnetic sensor. Themagnetic sensor may include a plurality of resistors electricallyinterconnected between one or more predetermined voltages and one ormore output terminals, such as in a bridge formation. At least one ofthe resistors may be a magnetoresistor formed from a patterned layer ofmagnetoresistive material. The magnetoresistor may be a variableresistor having an electrical resistance that varies as a function of amagnetic field to which the sensor is exposed. The electricalconfiguration of the sensor may utilize the variable resistor to providean output voltage at the output terminals as a function of the magneticfield.

FIG. 19 is a schematic diagram depicting an electrical representation ofan embodiment of a magnetic sensor. The magnetic sensor may include twopairs of resistors R1, R2, R3, R4 arranged in a bridge configurationbetween a supply voltage VS and ground, with first and second outputterminals taken at the middle of two legs of the bridge. One or more ofthe resistors, such as one resistor R2 from an upper half of one of thelegs of the bridge, and another resistor R3 from a lower half of theother of the legs, may be magnetoresistors. In operation, the bridge maybecome unbalanced and provide a corresponding output voltage V0 betweenthe output terminals as a result of the variation in resistance value ofthe variable resistors R2, R3 as a function of the magnetic fieldexperienced by the sensor.

Embodiments of a magnetic structure arranged to operate as a magneticsensor may include one or more standard resistors formed from anelectrically resistive material, such as polysilicon layer or adiffusion region formed in a substrate, and one or more magnetoresistorsformed from a patterned layer of magnetoresistive material.

Alternatively, embodiments of a magnetic structure arranged to operateas a magnetic sensor may include one or more standard resistors formedfrom a patterned layer of magnetoresistive material and a patternedlayer of magnetic shielding material, and one or more magnetoresistorsformed from the patterned layer of magnetoresistive material.

FIGS. 20(a)-20(f) depict embodiments of magnetic structures configuredto provide a magnetic sensor such as depicted in FIG. 19. FIG. 20(a)depicts a cross-sectional side view of a magnetic structure that may beused to implement a magnetic sensor. The magnetic structure may includea first patterned layer of material 348 formed on a first surface of alayer formed on a substrate, and a second patterned layer of material352 formed on a second surface of second layer formed on a substrate.The first and second surfaces may be displayed vertically from eachother.

The first patterned layer 348 may be used to implement resistors of themagnetic sensor. FIG. 20(c) depicts a cross-sectional top view of anembodiment of the magnetic sensor of FIG. 20(a), showing greater detailof an embodiment of the first patterned layer 348. The first patternedlayer 348 may include a plurality of separate segments 350, each of theseparate segments 350 implementing a different resistor of the magneticsensor. The first patterned magnetic layer 348 may include a firstmaterial such as a magnetoresistive material.

The second patterned layer 352 may operate as a magnetic shield toeliminate, reduce or otherwise alter the magnetic field in theenvironment in the vicinity of selected portions of the first patternedlayer 348. FIG. 20(b) depicts a cross-sectional top view of anembodiment of the magnetic sensor of FIG. 20(a), showing greater detailof an embodiment of the second patterned layer 352. The second patternedlayer 352 also may include a plurality of segments 354. Each of thesegments 354 may align vertically with a corresponding one of a subsetof the segments 350 of the first patterned layer 348. Each segment 354may channel or focusing the magnetic flux to shield the correspondingsegment of the first patterned layer 348 from the magnetic field. Thesecond patterned magnetic layer 352 may include a second material havinga relatively high permeability to magnetic fields, such as apermeability above a predetermined threshold, e.g., a soft magneticmaterial. The segments of the second patterned layer may occupy a largersurface area, from the perspective of a top or bottom view, than thecorresponding segments of the first patterned layer, in order to providemore effective shielding of those segments of the first patterned layer.

The magnetic structure may thus be used to provide both regular andmagnetoresistors from the same patterned layer of material. A firstsubset of segments of the first patterned layer 348 aligned withsegments of the second patterned layer 352, despite including materialsuch as magnetoresistive material, may provide a corresponding resistorin the magnetic sensor with no or a reduced sensitivity to the magneticfield about the sensor, such as the first and fourth resistors R1, R4 inFIG. 19, due to the presence of the magnetic shielding provided by thesecond patterned layer. A second subset of segments of the firstpatterned layer 348 not aligned with segments of the second patternedlayer 352 may provide magnetoresistors in the magnetic sensor with asensitivity to the magnetic field, such as the second and thirdresistors R2, R3 in FIG. 19, due to including material such asmagnetoresistive material without the presence of the magnetic shieldingprovided by the second patterned layer. Providing both regular andmagnetoresistors from the same patterned layer of material maysimplifying the fabrication of the magnetic device by eliminating theneed for a second resistive material and corresponding additionalfabrication steps.

The different layers of patterned material may be provided in differentstacking orders. FIG. 20(d) depicts a cross-sectional side view ofanother embodiment of a magnetic sensor having the first patterned layerof material 348 formed on a surface of a layer formed on a substrateabove a second patterned layer of material 352 formed on a surface ofanother layer formed on a substrate.

The first and second patterned layers also may include different shapeand geometrical configurations, such as any of the shape configurationsdepicted in FIGS. 2(a)-2(k), and various alignments of the first andsecond patterned layers relative to each other. FIGS. 20(e)-20(f) depicttop views of another embodiment of first and second patterned layers355, 357 of a magnetic sensor similar to that of the embodiments of FIG.20(a)-20(d), but in which the first and second patterned layers may havedifferent shape and geometrical configurations. In FIG. 20(f), the firstpatterned layer 355 may have a shape similar to that of FIG. 2(d), inwhich a first subset of rectangular portions are arranged in a firstarray in a first orientation and a second subset of rectangular portionsare arranged in a second array in a second orientation rotated 90°relative to the first orientation. In FIG. 20(e), the second patternedlayer 357 may have a single shape overlying an entire subset of therectangular portions.

The magnetic sensor may include other elements, such as conductors,which are show in schematic form in FIG. 20(c), as well as conductivestriping to enhance or select direction of sensitivity. Embodiments ofmagnetic sensor also may include different electrical configurations.

The magnetic device may include a first patterned layer and a secondpatterned layer arranged relative to each other similar to as shown inFIG. 20(a) but to produce other selected magnetic functionality. Thefirst patterned layer may include a material having a selected magneticproperty such as, e.g., a magnetoresistive material or a materialproducing a temporary or permanent magnetic field. The second patternedlayer may include magnetically shielding material, such as a materialhaving a permeability to magnetic fields above a predeterminedthreshold. Each of the first and second patterned layers may have any ofthe patterned layer properties discussed herein, such as any of thepatterned layer shapes discussed in regard to FIGS. 2(a)-2(k).Additionally, one or both of the first or second patterned layers mayhave the inverse of such shapes, i.e., may occupy only an area outsideof these shapes. Different combinations of the first and secondpatterned layers may produce different selected magnetic functionality.For example, in embodiments similar to that shown in FIG. 20(a), thefirst patterned layer may include specific patterned layer shapes andthe second patterned layer may include a subset of substantially thesame shapes or such a subset scaled to a predetermined degree larger orsmaller. Such embodiments may be useful to provide magnetic and otherfunctionality using the same first patterned layer. In otherembodiments, the first patterned layer may include specific patternedlayer shapes and the second patterned layer may include inverse shapes.Such embodiments may be useful to allow magnetic fields to reach thefirst patterned layer but not other components such as circuitry thatmay be adjacent, in between, or have some other spatial relationship tothe first patterned layer.

The magnetic device also may include a plurality of magnetic structuresstacked on top of each other on a substrate. FIG. 21 depicts a side viewof an embodiment of a magnetic device including a plurality of stackedmagnetic structures. The magnetic device may include a first magneticstructure 358 stacked on top of a second magnetic structure 362. Thestacked first and second magnetic structures 358, 362 may be stacked ontop of another device structure such as a substrate 366. The stackedmagnetic structures 358, 362 may be separated by one or more insulatingor shielding layers 370, 374. Each of the stacked magnetic structures358, 362 may include a layer of material 378, 382 having selectedmagnetic properties formed on a substrate 386, 390.

The magnetic device also may include a magnetic structure formed in orat least partially in a recess in a substrate or a recess in one or morelayers on a substrate. FIGS. 22(a)-22(b) depict embodiments of amagnetic device at a first stage of fabrication, after a substrate 394,398 is provided that includes one or more recesses 402, 406 formed inthe substrate 394, 398 or in one or more layers on the substrate 394,398. The one or more recesses 402, 406 may be shaped to have the sameshape as or encompass shapes of a magnetic layer. The substrate 394, 398may be processed to produce the one or more recesses 402, 406, such asby removing material from the substrate 394, 398 or layer on thesubstrate by one or more of etching, sputtering, etc. FIGS. 22(c)-22(d)depict embodiments of the magnetic device at a second stage offabrication, after a patterned layer 410, 414 of material having aselected magnetic property has been formed in the one or more recessesshown in FIGS. 22(a)-22(b). The shapes of the patterned layers 410, 414may be the same as the shapes of the recesses. Alternatively, a recessmay contain a layer having a different shape or a layer having aplurality of shapes.

The magnetic structure also may conformally coat or at least partiallyconformally coat one or more recess. FIG. 23(a) depicts an embodiment ofa magnetic device at a first stage of fabrication, in which a pluralityof recesses 415 are formed in a substrate or in one or more layers onthe substrate. The plurality of recesses may be separated from eachother by non-recessed surfaces 417, such as according to a periodicseparation distance. FIG. 23(b) depicts an embodiment of the magneticdevice at a second stage of fabrication, in which a patterned layer 419has been formed to conformally coat an area including the recesses andseparating surfaces. The patterned layer alternatively may coat only apartial portion of the area including the recesses and separatingsurfaces. FIG. 23(c) depicts another embodiment of the magnetic deviceat a second stage of fabrication, in which a patterned layer 421 hasbeen formed to conformally coat a partial portion of the area includingthe recesses and separating surfaces. This partial coating may be formeddirectly by forming the coating only in the partial area, oralternatively by forming a coating such as depicted in FIG. 23(b) andsubsequently removing a portion of the coating. The patterned layer alsomay coat only a portion of the recesses. FIG. 23(d) depicts anotherembodiment of the magnetic device at a second stage of fabrication, inwhich a patterned layer 423 has been formed to conformally coat apartial portion of the recesses, such as a bottom surface of therecesses. This partial conformal coating again may be formed directly byforming the coating only in the partial areas, or alternatively byforming a coating such as depicted in FIG. 23(b) and subsequentlyremoving a portion of the coating.

The magnetic device may include conductive wiring arranged about thepatterned layer formed in a recess. The conductive wiring may provide aconductive coil or other conductive interconnection about the magneticlayer. The conductive wiring may include one or more of a conductivelayer or a through silicon (or other substrate) via (TSV). Theconductive layer may include one or more of a horizontal conductivelayer or a vertical conductive layer.

FIGS. 24(a)-24(c) depict embodiments of a magnetic device at a firststage of fabrication, having a substrate 418, 422, 426 in which one ormore recesses 430, 434, 438 are formed and one or more TSVs 442, 446,450 are formed about the recesses 430, 434, 438. FIGS. 24(d)-24(f)depict embodiments of the magnetic device of FIGS. 24(a)-24(c) at asecond stage of fabrication, in which a patterned layer 454, 458, 462has been formed in the one or more recesses 430, 434, 438. FIGS.24(g)-24(i) depict embodiments of the magnetic device of FIGS.24(a)-24(f) at a third stage of fabrication, in which one or moreconductive layers 466, 470, 474 have been formed between the TSVs 442,446, 450 over the material 454, 458, 462 in the one or more recesses430, 434, 438. Another conductive layer may be formed at a lower layeror on the back side of the substrate to complete interconnection of theconductive wiring, such as to form conductive coils about the material454, 458, 462.

Conductive wiring about the patterned layer of material may form aconductive coil having a variety of configurations and for a variety ofpurposes. A conductive coil about the material may be used to generateor reinforce a magnetic field in the material. A conductive coil aboutthe patterned layer also may be used to set, such as to initialize orchange the direction of, a magnetization of the material, such as amagnetization of an anisotropic magnetoresistive material used toimplement a magnetoresistor. The conductive coil may include one or morewindings about one or more separate segments of the patterned layer atone or more locations of the segments. For example, in FIG. 24(g), theconductive coil may include a plurality of windings 478 about a singleseparate segment of the patterned layer. In FIG. 24(h), the conductivecoil may include a plurality of windings 482, 484 about each of aplurality of separate segments of the patterned layer. In FIG. 24(i),the conductive coil may include a first plurality of windings 488 abouta first location of a single continuous segment of the patterned layer,and a second plurality of windings 492 about a second location 482 ofthe single continuous segment of the patterned layer. The first andsecond pluralities of windings 488, 492 optionally may be used toprovide magnetic fields to the first and second locations of the segmentin different directions. The first and second locations of the singlesegment of the patterned layer optionally may be used to produce,conduct, channel or concentrate magnetic flux in different directions.

One or more patterned layer of material having a selected magneticproperty may be formed at a plurality of levels in and about a recess.FIGS. 25(a)-25(b) depict top and cross-sectional side views of anembodiment of a magnetic device at a first stage of fabrication, inwhich a recess 496 having a plurality of levels 500 is formed in asubstrate 504. Each of the plurality of levels 500 of the recess 496 mayinclude a surface. Each surface may be parallel to a primary plane ofthe substrate 504. Each surface also may be offset from other levelsurfaces by an inter-level distance. FIGS. 25(c)-25(d) depict top andcross-sectional side views of the magnetic device of FIGS. 25(a)-25(b)at a second stage of fabrication, in which a plurality of patternedlayers of material are formed at a plurality of levels in and about therecess 496. The patterned layers may include one or more patternedlayers 508 formed inside the recess on a surface of one of the levels500 inside the recess 496. Although the exemplary embodiment of FIGS.25(c)-25(d) depict a single patterned layer at a single level 500 insidethe recess 496, other embodiments may include a plurality of patternedlayers, each at a different level 500 inside the recess 496. Thepatterned layers also may include a patterned layer 512 formed on asurface bordering or about the boundary of the recess 496. The patternedlayers 508, 512 may have the same shape as the recess 496 or level ofthe recess 496 on or about which they are formed. The patterned layers508, 512 may be offset from each other according to the inter-leveldistances between levels on which they are formed.

Embodiments of the magnetic device may provide functionality based onthe presence of the patterned layers at different levels. For example, aplurality of layers provided on different levels offset from each otherby inter-level distances may be used to provide magnetic sensing as afunction of an axis along which the levels are offset. For example, themagnetic device in FIG. 25(d) may provide magnetic sensing as a functionof a central axis 516 of the recess 496. This may be useful to senseproperties of an object that may enter the recess 496, such as theposition of the object with respect to the central axis 516 or thepresence or level of a current associated with an object with respect tothe central axis 516.

Different types of magnetic structures may be formed in and about arecess. FIGS. 26(a)-26(b) depict top and cross-sectional side views ofan embodiment of a magnetic device at a first stage of fabrication, inwhich a recess 520 having a plurality of levels 524 is formed in asubstrate 528. FIG. 26(c) depicts a side cross-sectional view of themagnetic device of FIGS. 26(a)-26(b) at a second stage of fabrication,in which a patterned layer of material 532 having a selected magneticproperty is formed at a level 524 in the recess 520. FIG. 26(d) depictsa side cross-sectional view of the magnetic device of FIGS. 26(a)-26(c)at a third stage of fabrication, in which a magnetic structure 536 isplaced at another level 524 in the recess 520. The magnetic structure536 may include a patterned layer 540 formed on a substrate 544. In FIG.26(d), the patterned layer 532 formed on the level 524 of the recess 520may be formed at the same vertical height as the patterned layer 540formed on the substrate 544 placed in the recess 520. However, in otherembodiments, the patterned layer 532 on the level 524 in the recess 520may be at a different vertical height than that of patterned the layer540 on the substrate 544 in the recess 520.

The magnetic structure may include different shapes or portions ofshapes of patterned layers formed at different levels. FIG. 27(a)depicts a top view of an embodiment of a magnetic device includingpatterned layers 548, 552 having a plurality of separate arcuatesegments arranged to outline a ring. FIG. 27(b) depicts across-sectional side view of the magnetic device of FIG. 27(a) takenalong a first axis passing through a first subset of the segments 556.The first subset of segments 556 may be formed as a first patternedlayer 548 on a first surface of a substrate or layer on the substrate.FIG. 27(c) depicts a cross-sectional side view of the magnetic device ofFIG. 27(a) taken along a second axis passing through a second subset ofthe segments 560. The second subset of segments 560 may be formed as asecond patterned layer 552 at a second level in a recess in thesubstrate or on a layer of the substrate. Forming different shapes orportions of shapes of patterned layers on different levels may providespecific functionality of the magnetic devices, such as specificmagnetic sensing properties, resulting from the distribution ofgeometric shapes to different levels.

Magnetic structures also may be arranged about a recess to provide amagnetic flux concentrator. FIG. 28(a) depicts a cross-sectional sideview of an embodiment of the magnetic flux concentrator device of FIG.17(a), in which at least one of the patterned layers of the magneticflux concentrator may be formed on a surface of a level inside a recess564. Another of the patterned layers of the magnetic flux concentratormay be formed on a surface about the recess 564. In FIG. 28(a), themagnetic sensor also may be formed on a surface about the recess 564.However, in other embodiments, the magnetic sensor also may be formed ona surface of a level inside the recess 564. FIG. 28(b) depicts across-sectional side view of another embodiment of the magnetic deviceof FIG. 17(a), similar to the embodiment of FIG. 28(a), but in which themagnetic sensor may be formed on a surface of a level inside the recess564. Other embodiments may include further variations of distributionsof components of the magnetic flux concentrator and magnetic sensor todifferent levels in and about a recess.

Other magnetic devices discussed herein also may be configured in andabout one or more recesses. For example, one or more of the patternedlayers of the magnetic concentrator device of FIGS. 18(a)-18(b) also maybe formed in one or more recesses Similarly, one or more of thepatterned layers of the magnetic sensor device embodiments of FIGS.20(a)-20(f) may be formed in one or more recess.

The magnetic structure may be located on a back side of a substrate orin a recess on a back side of a substrate. FIG. 29 depicts across-sectional side view of a magnetic device including one or moremagnetic structures 568, each located in a corresponding recess 572 in aback side of a substrate 576. Each of the magnetic structures 568 mayinclude a patterned layer 580 formed on a substrate 584. The magneticdevice also may include one or more TSVs 588 electrically connecting themagnetic structures to a front side of the substrate, which may includeintegrated circuitry 592.

The magnetic structure also may include a patterned layer of materialhaving a selected magnetic property formed on an angled surface. Theangled surface may be a surface of a walls of a recess. Forming thepatterned layer on an angled surface may provide selected functionalityas a function of the angle of the surface, such as enabling one or moreof vertical or three-dimensional sensitivity for a magnetic sensorformed from such layers.

FIG. 30(a) depicts a cross-sectional side view of an embodiment of amagnetic device including a patterned layer 596 formed on an angledsurface 600 of a wall of a recess 604 in a substrate 608. The surface600 may be configured to have a predetermined angle relative to aprimary plane of the substrate 608 or a surface of a layer on thesubstrate 608. FIG. 30(b) depicts a top view of an embodiment of themagnetic device depicted in FIG. 29(a). The layer 596 may be patternedto form, e.g., a magnetic sensor. The recess 604 may have the same shapeas or encompass the patterned layer 596. As with other embodimentsdiscussed herein, the patterned layer 596 may have any of the patternedlayer properties discussed herein, such as any of the patterned layershapes discussed herein regard to FIGS. 2(a)-2(k).

The magnetic structure also may include patterned layers formed on aplurality of different angled surfaces. FIG. 31(a) depicts across-sectional side view of an embodiment of a magnetic deviceincluding a plurality of patterned layers 612, 616, each formed on adifferent angled surface 620, 624 of a wall of a recess 628 in asubstrate 632. Each of the surfaces 620, 624 may be configured to have acorresponding predetermined angle relative to a primary plane of thesubstrate 632 or a surface of a layer on the substrate 632. Thepredetermined angle for each wall optionally may be different than thatof the other walls. FIG. 31(b) depicts a top view of an embodiment ofthe magnetic device depicted in FIG. 31(a). The layers 612, 616 may bepatterned to form, e.g, a magnetic sensor. The recess 628 may be shapedto have the same shape as or encompass the patterned magnetic layers612, 616.

A plurality of patterned layers may be formed on a plurality ofdifferent angled surfaces of a plurality of different recesses. FIG. 32depicts a top view of another embodiment of a magnetic device includinga plurality of patterned layers 636, 640, 644, 648, each formed on adifferent angled surface 652, 656, 660, 664 forming a wall of adifferent recess. Each of the patterned layers 636, 640, 644, 648 mayinclude a plurality of separate segments oriented in a differentdirections.

The magnetic structure also may be formed on a cap mounted on asubstrate. FIGS. 33(a)-33(b) depict perspective and cross-sectional sideviews of an embodiment of a magnetic device having a magnetic structureformed on a cap 668 mounted on a substrate 672. The magnetic structuremay include a patterned layer of material 676 having a selected magneticproperty formed on a surface or in a recess of the top portion of thecap 668. The cap 668 may be mounted on the substrate 672 over asubstrate structure 680 to partially or completely enclose a volumeabout the substrate structure 680 from the environment outside the cap668. The cap 668 may include the top portion located over the substratestructure 680 and sidewalls extending from the top portion to thesubstrate 672. The cap 668 may optionally be a capping substrate formedfrom another substrate. The substrate structure 680 may be located underthe cap 668. The substrate structure 680 may include one or more ofintegrated circuitry, a micromechanical structure, a sensor structure,or another magnetic structure, etc.

The magnetic device also may include conductive wiring to electricallyinterconnect the magnetic structure on the cap with the circuitstructure under the cap. FIG. 33(c) depicts a cross-sectional side viewof an embodiment of the magnetic device similar to the embodiment ofFIGS. 33(a)-33(b), but which includes one or more TSVs 684 extendingthrough the cap from the top surface of the cap to the substrate underthe cap. The TSVs 684, optionally along with one or more conductivelayers, may electrically interconnect the magnetic structure with thesubstrate structure under the cap. FIG. 33(d) depicts a cross-sectionalside view of another embodiment of the magnetic device similar to theembodiment of FIGS. 33(a)-33(b), but which may include one or more wirebonds 688 extending from the top surface of the cap to the substrate toelectrically interconnect the magnetic structure on the cap to thesubstrate structure under the cap.

Magnetic structures also may be formed at a plurality of differentlevels on and about a cap. FIGS. 34(a)-34(b) depict perspective andcross-sectional side views of an embodiment of a magnetic device havingmagnetic structures formed at a plurality of different levels on andabout a cap 692 mounted on a substrate 696. A first magnetic structuremay include a first patterned layer 700 formed at a first level on thecap 692 as discussed above in regard to FIGS. 33(a)-(d). A secondmagnetic structure may include a second patterned layer 704 formed at asecond level on or in a recess in the substrate 696 about the cap 692.The first level may be offset from the second level by a predetermineddistance. The first and second magnetic layers 700, 704 may have acommon shape, such as concentric rings or aligned square or rectangularshapes. The second layer 704 may partially or wholly surround the cap692.

As with other embodiments discussed herein, a patterned layer formed ona cap may have a selected magnetic property to provide a selectedmagnetic functionality. In embodiments, the patterned layer may includea magnetoresistive material arranged to form a magnetic sensor. In otherembodiments, the patterned layer may include a material producing atemporary or permanent magnetic field. In yet other embodiments, thepatterned layer may include a magnetically shielding material, such as amaterial having a permeability to magnetic fields above a predeterminedthreshold.

Other structures may be formed on the cap in addition to the magneticstructure. FIG. 35 depicts an embodiment of a magnetic device includinga magnetic structure 708 and a conductive coil 712 formed on a cap 716mounted on a substrate 720. The conductive coil 712 may be formed inseparate area from the magnetic structure 708, as in FIG. 35, or may beformed under or above the magnetic structure. A conductive coil formedin a separate area may provide, e.g., a radio-frequency identificationstructure. A conductive coil formed below or above the magneticstructure may be used to provide a magnetic field to set or modify themagnetic properties of the magnetic structure.

The magnetic device also may provide a magnetic flux concentrator on orin the cap. FIG. 36(a) depicts an embodiment of a magnetic deviceincluding a first magnetic structure forming a magnetic fluxconcentrator and one or more second magnetic structures forming one ormore magnetic sensors in and about a cap mounted on a substrate. Themagnetic flux concentrator may include patterned layer of a material 717deposited in a sidewall of the cap. The patterned layer may extendsubstantially to the top and bottom of the sidewall, or to within apredetermined distance of the top and bottom. The patterned layer of themagnetic flux concentrator may be formed along a substantially verticalplane. The one or more magnetic sensors may include a patterned layer ofmaterial 715, 719 formed on the cap and/or on the substrate. Thepatterned layers may be formed within a predetermined distance of theends of the patterned layer of the magnetic flux concentrator. Thepatterned layers of the magnetic sensors may be formed along asubstantially horizontal plane. The patterned layer of the magnetic fluxconcentrator may include a material having a relatively highpermeability to magnetic fields, such as a permeability above apredetermined threshold, and the patterned layers of the magneticsensors may include a magnetoresistive material.

In operation, the magnetic flux concentrator may channel or concentratemagnetic flux as it travels in a vertical direction 721 in an area aboveand below the patterned layer into the patterned layer. This channelingor concentrating may produce localized translation of the magnetic fluxfrom a vertical direction or similar directions to a horizontaldirection or similar directions 723 near the ends of the magnetic fluxconcentrator where the magnetic sensors are located. Channeling and/orconcentrating of the magnetic flux may enable the magnetic sensor tosense a vertical magnetic field using an operational sensitivity tomagnetic fields along the horizontal direction instead of the verticaldirection.

FIG. 36(b) depicts another embodiment of a magnetic device similar tothe embodiment of FIG. 36(a), but in which a magnetic flux concentratormay include patterned layer of a material 725 deposited on a surface ofthe sidewall of the cap.

Additionally, the magnetic structure may be formed on the cap accordingto any of the embodiments of the magnetic structure formed on asubstrate discussed herein, such as in regard to FIGS. 7 to 44 and theirvarious subfigures (i.e., (a), (b), etc.), among other embodiments, withthe cap being the substrate and having corresponding substratestructures.

The magnetic structure also may include a patterned layer formed on oras part of a micromechanical structure. The micromechanical structuremay include one or more of a variety of different structures, includingone or more of a beam, a plate, a comb, a diaphragm, or a gear, etc. Thepatterned layer may form part or all of a mechanically active portion ofthe micromechanical structure.

FIG. 37(a) depicts an embodiment of a magnetic device including amagnetic structure having a patterned layer forming a micromechanicalbeam 724 suspended from a substrate 728. The beam 724 may be acantilever including an anchor portion 732 connecting the beam 724 tothe substrate 728 and a suspended portion 736 suspended over anotherportion of the substrate 728. The suspended portion 736 of the beam 724may be flexible, and may be configured to bend toward and away from thesubstrate in response to stimuli. The patterned layer may include amaterial that produces a permanent or temporary magnetic field. Thepatterned layer may form substantially the entire beam 724, includingboth the anchor portion 732 and the suspended portion 736, as shown inFIG. 37(a). However, the patterned layer of the magnetic structurealternatively may form only a part of the micromechanical device. FIG.37(b) depicts another embodiment of a magnetic device similar to theembodiment depicted in FIG. 37(b), but in which a patterned layer mayform only a part of the micromechanical device, such as a patternedlayer 740 on a suspended portion of a beam, which may be formed formanother material, such as an oxide, polysilicon or other material.

The magnetic device also optionally may include another magneticstructure including a patterned layer 744 formed under themicromechanical structure on, in, or in a recess of the substrate 728.The patterned layer may include a material that produces a permanent ortemporary magnetic field. The second magnetic structure may interactmagnetically with the magnetic structure of the micromechanicalstructure 724. Other embodiments may omit the second magnetic structure744 formed under the micromechanical structure 724.

The magnetic device may further include a cap 748 mounted on thesubstrate 728 about the micromechanical structure 724. The cap 748 maypartially or wholly enclose the micromechanical structure 724 to protectthe micromechanical structure 724 from the environment about themagnetic device.

The magnetic device also may include conductive wiring to electricallyinterconnect the micromechanical structure to other device components.The conductive wiring may include a conductive layer 752 electricallyinterconnecting the magnetic structure to other locations on the sameside of the substrate 728 as the micromechanical structure 724, as shownin FIG. 37(a). The conductive wiring also may include one or conductivelayers and TSVs interconnecting the micromechanical device to locationson the opposite side of the substrate. FIG. 37(c) depicts anotherembodiment of a magnetic device similar to the embodiment depicted inFIG. 37(a), but in which the magnetic device may include one orconductive layers 756 and TSVs 760 interconnecting the micromechanicaldevice to locations on the opposite side of the substrate.

In operation, the micromechanical beam structure depicted in FIGS.37(a)-37(c) may provide a variety of functionality, such as operating asa switch, a sensor, etc. For example, the micromechanical beam structuremay operate as a magnetic switch such as a reed relay to make anelectrical interconnection between a conductive contact 764 at a freeend of the beam 724 and a second conductive contact 768 on the substrate728 under the free end of the beam 724 in response to external stimulisuch as a magnetic field. The micromechanical beam structure also may beused to detect external magnetic fields as a function of the deflectionof the beam structure in response to such fields. The micromechanicalbeam structure further may be used to produce selectively changingmagnetic fields by moving the beam structure in response to a stimulisuch as a magnetic field or acceleration. A selectively changingmagnetic field may be used in various applications such as, e.g.,implementing an isolated data link.

The magnetic device may include a plurality of micromechanicalstructures formed in part or in whole from magnetic structures. FIGS.38(a)-38(b) depicts top views of embodiments of a magnetic deviceincluding a plurality of micromechanical beams 771, 772 formed frompatterned layers similar to as shown in FIGS. 37(a)-37(b). In FIG.38(a), the plurality of beams 771 may be arranged adjacent to eachother, in a same spatial orientation, in a one dimensional array. InFIG. 38(b), the plurality of beams 772 may be arranged with spatialorientations at angles relative to each other, such as at angles of 90°or 180°. The plurality of micromechanical structures may be arrangedrelative to each other to implement various devices, such as, e.g., aninterconnected array of magnetic switches. For example, the embodimentof FIG. 38(a) may be used to detect or otherwise provide functionalityas a function of a variation of a magnetic field along the array ofbeams. The embodiment of FIG. 38(b) may be used to detect or otherwiseprovide functionality as a function of a directionality of a magneticfield relative to the array of beams as a whole.

A micromechanical beam structure formed from a magnetic structure alsomay be configured to bend laterally instead of or in addition to towardand away from the substrate. The micromechanical beam may be configuredto bend in a particular direction by dimensioning the beam below apredetermined thickness in that direction to allow flexing of the beam.FIGS. 39(a)-39(b) depict top and side views of embodiments of a magneticdevice including a micromechanical beam 773 formed from a patternedlayer similar to as shown in FIGS. 37(a)-37(b), but in which the beammay be configured to bend laterally from side to side, in a directionparallel to a primary plane of the substrate, instead of or in additionto bending toward and away from the substrate. The magnetic device alsomay include one or more elements positioned laterally on one or moresides of the beams. The lateral elements may be or include one or moreof a movement limiting structure, an electrical contact, or a secondarymagnetic structure.

The magnetic device may include a plurality of micromechanical beamsformed from magnetic structures and configured to move laterally. FIG.40 depicts a top view of an embodiment of a magnetic device including aplurality of micromechanical beams 777 formed from a patterned layersimilar to as shown in FIGS. 39(a)-39(b). The plurality of beams may bearranged in spatial orientations at angles relative to each other, suchas at angles of 90° or 180°. In other embodiments, the plurality ofbeams may be arranged adjacent to each other, in a same spatialorientation, in a one dimensional array, such as similar to as shown inFIG. 38(a). As discussed above, a plurality of micromechanicalstructures may be arranged relative to each other to implement variousdevices. For example, the embodiment of FIG. 40 also may be used todetect or otherwise provide functionality as a function of adirectionality of a magnetic field relative to the array of beams as awhole.

The micromechanical beam formed from the magnetic structure may takeforms other than the cantilever beams depicted in FIGS. 37-40. FIG.41(a)-41(b) depict side views of additional embodiments ofmicromechanical beam structures that may be formed from a magneticstructure. In FIG. 41(a), the beam structure 776 may include first andsecond anchor portions 780, 784, at opposite ends of the structure 776,connecting the structure 776 to a substrate 786, and a suspended portion788 suspended over the substrate 786. In FIG. 41(b), the beam structure792 may include a central anchor portion 796 connecting the structure792 to a substrate 800, and first and second suspended portions 804, 808suspended over the substrate 800. In each case, the suspended portion ofthe beam may be flexible and bend in response to magnetic stimuli.

Although FIGS. 38-41 depict beam structures formed wholly from patternedlayers, in other embodiments, these micromechanical beam structures maybe formed either in whole or in part from a patterned layer, such asshow by comparison in FIGS. 37(a)-37(b). Additionally, although forclarity of illustration FIGS. 38-41 essentially depict only theplurality of micromechanical structures, the magnetic device also mayinclude other components to enable and/or augment the function of thesestructures, such as one or more of a cap, electrical connections, secondmagnetic structure, etc., similar to as shown in FIGS. 37(a)-37(c).

The magnetic structure also may be formed on or as part of other typesof micromechanical structures. For example, the magnetic structure maybe formed on or as part of a micromechanical diaphragm. FIGS.42(a)-42(c) depict cross-sectional side views of a magnetic deviceincluding a magnetic structure formed on a micromechanical diaphragmformed on a substrate 803. The diaphragm may include one or more anchorportions 805 connected to the substrate, and a suspended portion 807suspended over an area of the substrate. The suspended portion may beflexible, and may be configured to bend toward and away from thesubstrate in response to stimuli. The suspended portion may include oneor more recesses 809 in which a patterned layer 811, 815, 817 may beformed. The patterned layer may partially fill the recesses, such as inFIG. 42(a), wholly fill the recess, such as in FIG. 42(b), or overflowthe recess, such as in FIG. 42(c). The patterned layer may include amaterial that produces a permanent or temporary magnetic field.

A cap such as shown in FIGS. 33-37 also may be configured as amicromechanical diaphragm such as shown in FIGS. 42(a)-42(c).

The magnetic structure also may be formed on or as part of other typesof micromechanical structures. For example, the magnetic structure maybe formed on or as part of a micromechanical scanner. FIGS. 43(a)-43(b)depict top and bottom views of a magnetic device including a magneticstructure formed on a micromechanical scanner. The micromechanicalscanner may include the rotatable platform 819, an inner actuating ring821, and an outer actuating ring 823. The micromechanical scanner may beformed from a substrate or layers on a substrate.

The rotatable platform may include a top surface on which a layer ofmaterial having a selected reflectance may be formed, a bottom surfaceon which a patterned layer of material 825 having a selected magneticproperty and a set of electrical contacts 829 connected to the patternedlayer may be formed, and a set of electrostatic actuator components 827such as drive combs. The rotatable platform may be connected to theinner actuating ring by one or more torsional springs 831. The inneractuating ring may include first and second sets electrostatic actuatorcomponents 832, 833 such as drive combs. The inner actuating ring may beconnected to the outer actuator ring by one or more torsional springs835. The outer actuator ring may include a set of electrostatic actuatorcomponents 837 such as drive combs, and a set of electrical contacts839. The electrical contacts of the rotatable platform may beelectrically connected to the electrical contacts of the outer actuatorring by a set of bond wires 841. Although shown as having essentiallysquare outlines in FIGS. 43(a)-43(b), the rotatable platform, inneractuating ring, and outer actuating ring alternatively may be formed tohave other outlines, such as rectangular, circular, or ellipticaloutlines, etc.

The patterned layer may include a magnetoresistive material arranged toform a magnetic sensor. For clarity of illustration, the patterned layeris shown as a single square region in FIG. 43(b), but may insteadinclude any of patterned layer shape configurations discussed herein,such as one or more patterned layer shapes electrically interconnectedand arranged to form a magnetic sensor.

In operation, the rotatable platform may rotate about a first axis 843in response to the application of electric signals to the electrostaticactuator components of the platform and inner actuator ring. Similarly,the rotatable platform may be rotated about a second axis 845 inresponse to the application of electric signals to the electrostaticactuator components of the inner actuator ring and the outer actuatorring. FIGS. 44(a)-44(c) depict cross sectional front views of themagnetic device, taken along an axis offset from the torsional springs.In FIG. 44(a), the rotatable platform may be in a quiescent state, withno rotation about either axis. In FIG. 44(b), the rotatable platform maybe rotated about the first axis. In FIG. 44(c), the rotatable platformmay be rotated about the second axis. The reflective layer may scan alight source such as a laser directed onto the rotatable platform in acorresponding two dimensional pattern. The magnetic sensor may providean output signal representing the orientation of the rotatable platformby sensing the magnetic field in the environment of the magnetic device,which may have a known orientation relative to the magnetic device as awhole. For clarity of illustration, the bond wires 841 are omitted fromFIGS. 44(a)-44(c), however they may be configured to have sufficientsize and flexibility to accommodate the rotation of the platform aboutboth axes while still maintaining an electrical connection between theelectrical contacts 829 on the rotatable platform and the electricalcontacts 839 on the outer ring.

Any of the embodiments of the magnetic device discussed herein mayinclude a magnetic structure having a patterned layer having any ofphysical connections or arrangements relative to the substrate discussedherein, such as any of the connections or arrangements discussed inregard to any of FIGS. 7 to 44 and their various subfigures (i.e., (a),(b), etc.), among other connections and arrangements.

The magnetic device may include a magnetic structure connected to orarranged relative to a structure of a package. FIG. 45 depicts anembodiment of the magnetic device 801 as a packaged magnetic devicehaving the magnetic structure connected or arranged relative to astructure of a package. The magnetic device may include package 803, amagnetic structure 805, one or more substrates 807, and an associatedcircuit 809.

The package may include one or more package structures 811, such as oneor more of an aperture, an enclosure, etc. The magnetic structure may bephysically connected or arranged relative to the one or more packagestructures in a predetermined manner.

The magnetic structure, substrate, substrate structure 815, and circuitof the packaged magnetic device may include any of the embodiments ofthese components and their interconnections and arrangements discussedabove in regard to any other embodiments of the magnetic device, such asdiscussed above in regard to FIGS. 7 to 44 and their various subfigures(i.e., (a), (b), etc.), among other embodiments.

FIG. 46 depicts an embodiment of a packaged magnetic device. Thepackaged magnetic device may include the magnetic structure, a package,and the corresponding circuit. The magnetic structure may include apatterned layer 856 formed on a substrate 860. The associated circuitmay include an integrated circuit 864 formed on one or more additionalsubstrates. The magnetic structure and its substrate may be attached tothe integrated circuit to form a substrate stack.

The package may include an enclosure 868 to selectively expose a portionof the magnetic structure while enclosing other portions of the device.The enclosure may include an aperture 857 to expose a portion of themagnetic structure, such as a surface of the patterned layer or a coatedsurface of the patterned layer, to an environment external to thepackage, and an enclosing portion 859 enclosing another portion of oneor more of the magnetic structure or the circuit to provide a barrier tothe external environment. Exposing the magnetic structure to theexternal environment may enhance the magnetic performance of themagnetic structure by providing selective access to or from the magneticstructure by a magnetic field. Enclosing the other portion of themagnetic structure or integrated circuit may enhance the electricalperformance of the other portion of the magnetic structure or integratedcircuit by selectively preventing access to or from the magneticstructure by a magnetic, electric or electromagnetic field, or provideother types of protection from the external environment. The packagealso may include a conductive lead frame and wire bonds to provideelectrical connections between terminals of the package and one or moreof the magnetic structure or the integrated circuit.

In other embodiments, a packaged magnetic device may include themagnetic structure and circuit formed together on a single substrate,such as on the same or different sides of such a substrate, that ispackaged similarly to as shown in FIG. 42.

FIG. 47(a) depicts a cross-sectional view of another embodiment of apackaged magnetic device, incorporating a magnetic structure formed onor as part of a micromechanical scanner such as shown in FIGS. 43 and44. The packaged magnetic device may include an enclosure 965, asubstrate 967 containing a micromechanical scanner 969 such as shown inFIGS. 43 and 44, a package substrate 971, a lens 973 and one or moreelectrical interconnections 975. For clarity of illustration, themicromechanical scanner 969 is shown as a single schematic entity,however it may include all of the components shown in FIGS. 43-44. Theenclosure may include an aperture 977 to position the lens and admitlight to the scanner, and a portion 978 to receive and position thescanner relative to the aperture and lens. The electrical connections,which may include bond wires, may electrically connect the scanner tothe package substrate. As discussed above in regard to FIGS. 43 and 44,a patterned layer of magnetoresistive material 979 forming a magneticsensor may be formed on the scanner.

The packaged magnetic device may also include a second patterned layer.The second patterned layer may include a material providing apredetermined permanent or temporary magnetic field. FIGS. 47(b) and47(c) depict cross-sectional views of embodiments of a packaged magneticdevice similar to as shown in FIG. 47(a), but including a secondpatterned layer. In FIG. 47(b), the second patterned layer 981 may beformed on a portion of the package enclosure or the package substrate.In operation, the second patterned layer may provide a predeterminedmagnetic field about the scanner, and the magnetic sensor formed formthe first patterned layer may provide an output representing therotational position of the scanner based on the magnetic field sensed bythe sensor. In FIG. 47(c), the nature of the patterned layers may bereversed, with a first patterned layer 983 formed on the scannerincluding a material providing the predetermined magnetic field, and asecond patterned layer 985 formed on the package enclosure or packagesubstrate including a magnetoresistive material forming a magneticsensor. Such an embodiment may operate according to similar principlesas for the embodiment of FIG. 47(b), but with the generating and sensingof magnetic fields performed at interchanged locations.

The magnetic device may include a magnetic structure connected to orarranged relative to a structure of a module incorporating a pluralityof substrates. FIG. 48 depicts an embodiment of a magnetic device 817 asa module-based magnetic device. The magnetic device may include aplurality of substrates 819, a magnetic structure 821, and an associatedcircuit 823. The magnetic device also may optionally also include one ormore other structures 825, such as a coil, cap, micromechanicalstructure, antenna, etc.

The magnetic structure may be physically connected or arranged relativeto one or more structure 827 of one or more of the module substrates.For example, the magnetic structure may be physically connected orarranged relative to structures of one or more of the module substrateaccording to any of the embodiments of the magnetic structure andsubstrates and their interconnections and arrangements discussed abovein regard to substrate-based magnetic device, such as discussed above inregard to FIGS. 7 to 44 and their various subfigures (i.e., (a), (b),etc.), among other embodiments. In embodiments, the magnetic structuremay be formed on one of the substrates according to any of theseembodiments, while the plurality of substrates may include a furtherplurality of substrates connected to an arranged relative to themagnetic structure and first substrate as discussed below.

The magnetic structure, substrate, circuit and other structures of themodule magnetic device may include any of the embodiments of thesecomponents and their interconnections and arrangements discussed abovein regard to other magnetic device embodiments.

FIG. 49(a) depicts a perspective view of an embodiment of a module 812that may include one or more magnetic structures (or magnetic structureson substrates) 816 and a substrate structure having a plurality ofsubstrates 820. FIG. 49(b) depicts a cross-sectional side view of themodule shown in FIG. 49(a). The substrate structure may include aplurality of substrates 820 layered on top of each other. Inembodiments, the substrate structure may be a laminated substratestructure including a plurality of laminated layers.

The one or more magnetic structures may be attached to a substrate ofthe substrate structure. The magnetic structure 816 may be attached to asubstrate of the substrate structure so that the magnetic structurefully embedded within the substrate structure, as shown in FIG. 49(b).Alternatively, the magnetic structure may be attached to a substrate ofthe substrate structure so that the magnetic structure is exposed at anexternal surface of the module. FIG. 49(c)-49(d) depict cross-sectionalside views of embodiments of the magnetic module similar to that shownin FIG. 49(a)-49(b), but in which the magnetic structure may be attachedto a substrate of the substrate structure so that the magneticstructure, such as a surface of a patterned layer or a coated surface ofa patterned layer, is exposed at an external surface of the module. InFIG. 49(c), a plurality of magnetic structures 824 may be attached to asubstrate of the substrate structure so that the magnetic structures,such as surfaces of patterned layers or coated surfaces of patternedlayers, are exposed at an external surface on a same side of the module.In FIG. 49(d), a plurality of magnetic structures 828 may be attached tosubstrates of the substrate structure so that the magnetic structures,such as surfaces of patterned layers or coated surfaces of the patternedlayers, are exposed at external surfaces on different, such as opposing,sides of the module.

The module also may include one or more components attached to thesubstrates of the substrate structure in addition to the magneticstructure. The components may be electrically connected to the magneticstructure by one or more of conductive traces or vias laid along orthrough the substrates.

The magnetic structure may be physically aligned with apertures in aplurality of substrates. FIG. 50(a) depicts an exploded view of anembodiment of a magnetic device including a patterned layer 832 of amagnetic structure with an aperture aligned to apertures in a pluralityof substrates 836, 840 of a substrate structure. The substrate structuremay include the plurality of substrates stacked on top of each other,such as, for example, in a module. The patterned layer may be locatedbetween two substrates so that an aperture in the patterned layer alignswith apertures in each of the substrates. As discussed above in regardto FIGS. 15-16, the alignment of the apertures may create a path oftravel for another component or device from one side of the magneticdevice to another side of the magnetic device. FIG. 50(b) depicts a sideview of an embodiment of the magnetic device shown in FIG. 50(a). Thepatterned layer may optionally be positioned within a recess formed inone or more of the substrates to allow for a tighter packing of thesubstrates into a stacked substrate structure.

The magnetic structure also may be physically aligned with one or moreapertures in a module. FIG. 51(a)-51(b) depict perspective andcross-sectional side views of an embodiment of a magnetic module 844that may include one or more magnetic structures aligned with anaperture 845 in a substrate structure having a plurality of substrates848. The aperture may extend from one side to another side of the modulethrough a plurality of substrates 848. The magnetic structures 852 maybe connected to one or more of the substrates at the sides of theaperture so that the magnetic structures are exposed to the aperture.FIG. 51(c) is a cross-sectional side view depicting another embodimentof a magnetic module similar to the embodiment depicted in FIG. 51(b),but in which an aperture may extend from one side of the module througha plurality of substrates and end in the interior of the module, and amagnetic structure 853 may be connected to one or more of the substratesat the bottom of the aperture so that the magnetic structure is exposedto the aperture. FIG. 51(d) is a perspective view depicting anotherembodiment of a magnetic module similar to the embodiment depicted inFIGS. 51(a)-51(b), but in which an additional aperture 855 may extendfrom a third side of the module through a plurality of the substrates toa fourth side of the module, the additional aperture intersecting thefirst aperture.

The magnetic structure also may be provided in association with amicro-fluidic structure. FIG. 52(a) is a cross-sectional side viewdepicting an embodiment of a portion of the magnetic device including amicro-fluidic channel 857 and a magnetic structure 859. The channel mayinclude an inlet 861 to accept a flow of fluid into a first channelportion 863, a channel structure 865 to separate the channel into aplurality of second channel portions 867, and a plurality of outlets toprovide fluid outflow from the second channel portions. The magneticstructure may include one or more patterned layers formed about aportion of the channel, such as a patterned layer formed connected oradjacent to a wall at least partially forming the channel. For example,as depicted in FIG. 52(a), the magnetic structure may include a firstpatterned layer formed connected to or adjacent to a first wall at leastpartially forming the channel, such as a layer 869 formed on top of atop wall of the channel, and a second patterned layer formed connectedto or adjacent to a second wall at least partially forming the channel,such as a layer 871 formed below a bottom wall at least partiallyforming the channel.

The patterned layer may include a material producing a magnetic field.In embodiments, the patterned layer may include a material producing apermanent magnetic field. In FIG. 52(a), the patterned layer may includea hard magnetic material producing a permanent magnetic field. In otherembodiments, the patterned layer may include a material producing atemporary magnetic field. In such embodiments, the magnetic device alsomay include a coil connected to or arranged relative to the patternedlayer in a predetermined manner to set and/or change a magnetic field inthe material. FIG. 52(b) is a cross-sectional side view depictinganother embodiment of a portion of the magnetic device including amicro-fluidic channel and a magnetic structure such as shown in FIG.52(a) and conductive coils 873, 875. The magnetic structure may includea patterned layer including a soft magnetic material producing atemporary magnetic field. The conductive coils may be driven by theassociated circuit of the magnetic device to produce a magnetic field toset and/or supplement the magnetic field produced by the material, suchas to provide one or more of a static magnetic field having a singlefield orientation, or a changing magnetic field having changing fieldorientations.

In operation, a fluid flowing into the channel at the inlet may includea plurality of different types of particles having different responsesto magnetic fields, and the magnetic structure may be used to provide amagnetic field to separate the different types of particles intorespective different ones of the second channel portions. For example,as depicted in FIGS. 52(a)-52(b), fluid flowing into the channel inletmay include a first type of particles 877 that may move in a firstdirection toward a first of the second channel portions in response to aselected applied magnetic field, and a second type of particles 879 thatmay move in a second direction toward a first of the second channelportions in response to a selected applied magnetic field. The differenttypes of particles may exhibit different responses to the magnetic fieldas a result of their own magnetic properties. In other embodiments, thefluid or particles added to the fluid may exhibit a response to themagnetic field, producing a characteristic of the fluid flow, such as adensity gradient, that may separate the different types of particlesaccording to their density.

The magnetic device may incorporate micro-fluidic and magneticstructures such as shown in FIGS. 52(a)-52(b) in a variety ofconfigurations. FIG. 52(c) depicts an embodiment of a magnetic deviceincluding the micro-fluidic and magnetic structures such as shown inFIG. 52(a)-52(b) as one or more layers in a multi-layer structure. Thelayers 881 of the multilayer structure may take a variety of forms. Inembodiments, the layers of the multilayer structure may be layers formedon a substrate. In other embodiments, the layers of the multilayerstructure may include substrates of a multi-substrate structure such asa magnetic module.

The magnetic device may include a magnetic structure connected to orarranged relative to a structure of a system. FIG. 53 depicts anembodiment of the magnetic device 883 as or as part of a system havingthe magnetic structure connected or arranged relative to a structure ofthe system. The magnetic device may include a magnetic structure 885, asystem structure 887, and an associated circuit 889. The systemstructure may include any of the structures connected to or arrangedrelative to the magnetic structure discussed in regard to any otherembodiment of the magnetic device herein. The magnetic structure, systemstructure, and circuit may include any of the embodiments of thesecomponents and their interconnections and arrangements of anyembodiments of the magnetic device discussed herein.

The magnetic device also may include a magnetic structure including aplurality of aligned patterned layers. FIG. 54(a) depicts an explodedview of an embodiment of magnetic structure including a plurality ofpatterned layers 872 arranged in a stack. Each of the patterned layersmay include an aperture aligned with apertures of the other magneticstructures in the stack. Each of the patterned layers also mayoptionally include a boundary or shape aligned to that of the othermagnetic structures in the stack. The patterned layers may each beseparately formed patterned layers such as discussed above in regard toFIGS. 10(a)-10(b). FIG. 54(b) depicts a non-exploded perspective view ofthe magnetic structure depicted in FIG. 54(a).

The magnetic structure also may include a plurality of aligned patternedlayers arranged in combination with other layers. FIG. 55(a) depicts anexploded view of an embodiment of magnetic structure including aplurality of patterned layers 876 arranged in combination with otherlayers 880 in a stack. Each of the patterned layers and the other layersmay include an aperture aligned with apertures of the other layers inthe stack. Each of the patterned layers also may optionally include aboundary or shape aligned to that of the other magnetic structures inthe stack. The patterned layers may each be separately formed patternedlayers, such as with or without a corresponding substrate, as discussedabove. The other layers may include a non-magnetic material such as asubstrate on which the patterned layers may be formed or a separatespacer. FIG. 55(b) depicts a non-exploded perspective view of themagnetic structure depicted in FIG. 55(a).

As discussed above, the magnetic device may include circuitry that maybe electrically connected to one or more of the magnetic structure andother device structures to provide functions such as providing,receiving, conditioning, and processing of signals of the magneticstructure and other device structures.

The magnetic device may incorporate the circuit on a same substrate asthe magnetic structure. For example, the magnetic device may incorporatethe circuit and the magnetic structure on a same side of a substrate,each in a separate area or in the same area. Alternatively, the magneticdevice may incorporate the circuit on a different side of a substratefrom the magnetic structure. The magnetic device also may incorporatethe circuit on a different substrate than that including the magneticstructure.

The magnetic device may include a circuit to perform one or more ofreceiving and manipulating an electrical signal from the magneticstructure of the magnetic device, generating and providing an electricalsignal to the magnetic structure, generating and providing an electricalsignal to a conductive coil, or generating and providing an electricalsignal to a transmitter, among other functions.

For example, the magnetic device may include a circuit to receive andmanipulate electrical signals from the magnetic structure. FIG. 56depicts an embodiment of the magnetic structure and a circuit that maybe used to receive and manipulate electrical signals from the magneticstructure. The circuit may include an amplification circuit 900, ananalog-to-digital converter (ADC) 904, and a processor or controller908. The amplification circuit 900 may be electrically coupled to themagnetic structure to receive an output of the magnetic structure andperform one or more of buffering or amplifying the signal received fromthe magnetic structure. The amplification circuit 900 may include one ormore operational amplifiers to perform the buffering or amplifying. TheADC 904 may be electrically coupled to the amplification circuit toreceive an output of the amplification circuit 900 and convert thereceived signal from an analog to a digital representation. The ADC 904may include one or more of a flash ADC, pipeline ADC, sigma-delta ADC,successive approximation ADC, etc. The processor or controller 908 maybe electrically coupled to the ADC 904 to receive an output of the ADC904 and perform one or more of processing the received digitized signalto extract information from the digitized signal or generate a controlsignal as a function of the digitized signal.

The magnetic device also may include a circuit to generate and providean electrical signal to the magnetic structure. FIG. 57 depicts anembodiment of the magnetic structure and a circuit that may be used togenerate and provide an electrical signal to the magnetic structure. Thecircuit may include a processor or controller 916, a digital-to-analogconverter (DAC) 920, and a driver circuit 924. The processor orcontroller 916 may generate a control signal representing an electricalsignal to be provided to the magnetic structure. The processor orcontroller 916 may generate the control signal by as a function of adigitized signal representing a signal output by the magnetic structureor another signal. The DAC 920 may be electrically coupled to theprocessor or controller to receive the control signal output by theprocessor or controller 916 and convert the control signal from adigital to an analog representation. The DAC 920 may include one or moreof a R-2R ladder DAC, an oversampling DAC, a hybrid DAC, etc. The drivercircuit 924 may be electrically coupled to the DAC 920 to receive theanalog signal output from the DAC 920 and provide a corresponding drivesignal to the magnetic structure. The driver circuit 924 may perform oneor more of buffering or amplifying the signal from the DAC 920. Thedriver circuit 924 may include one or more transistors to perform thebuffering or amplifying.

The magnetic device also may include a circuit to generate and providean electrical signal to a conductive coil. The conductive coil may beused to generate a magnetic field to set or alter properties of, or tobe otherwise used in association with, the magnetic structure. FIG. 58depicts an embodiment of a circuit that may be used to generate andprovide an electrical signal to the conductive coil. The circuit mayinclude a processor or controller 932, a digital-to-analog converter(DAC) 936, and a driver circuit 940. The processor or controller 932 maygenerate a control signal representing an electrical signal to beprovided to the conductive coil. The processor or controller 932 maygenerate the control signal by as a function of a digitized signalrepresenting a signal output by the magnetic structure or anothersignal. The DAC 936 may be electrically coupled to the processor orcontroller to receive the control signal output by the processor orcontroller 932 and convert the control signal from a digital to ananalog representation. The DAC 936 may include one or more of a R-2Rladder DAC, an oversampling DAC, a hybrid DAC, etc. The driver circuit940 may be electrically coupled to the DAC 936 to receive the analogsignal output by the DAC 936 and provide a corresponding drive signal tothe conductive coil. The driver circuit 940 may perform one or more ofbuffering or amplifying the signal from the DAC 936. The driver circuit940 may include one or more transistors to perform the buffering oramplifying.

The magnetic device also may include a circuit to generate and providean electrical signal based on a signal from the magnetic structure, suchas representing a magnetic field or current sensed by the magneticstructure, for transmission. FIG. 59 depicts an embodiment of a magneticsensor and a circuit that may be used to generate and provide anelectrical signal to a transmitting element. The circuit may include anamplification circuit 945, and ADC 947, a transmitter 949 and atransmitting element 951 such as a conductive coil, antenna, etc. Theamplification circuit and ADC may be configured and operate as discussedabove in regard to the circuit of FIG. 49. The transmitter circuit maybe electrically coupled to the ADC to receive the digital signal outputby the ADC and provide a corresponding transmission drive signal to thetransmitting element.

In embodiments where the magnetic structure forms a magnetic sensor,such as, e.g., an anisotropic magnetoresistive sensor or othermagnetoresistive sensor, several embodiments of the amplification anddriver circuits may be provided. FIG. 60 depicts an embodiment of amagnetic sensor 960 and an amplification circuit 964 to provide anoutput representing a sensed magnetic field. The amplification circuitmay include a single operational amplifier, and the magnetic sensor mayinclude a single magnetoresistor 968. FIG. 61 depicts an embodiment of amagnetic sensor 968 and an amplification circuit and linearizing circuit972 to provide a linearized output representing a sensed magnetic field.The amplification and linearizing circuit may including a singleoperational amplifier, and the magnetic sensor may include a singlemagnetoresistor. FIG. 62 depicts another embodiment of a magnetic sensor976, an amplification circuit 980, and a linearizing circuit 984 toprovide a linearized output representing a sensed magnetic field. Theamplification and linearizing circuits may each include an operationalamplifier, and the magnetic sensor may include a single magnetoresistor.FIG. 63 depicts an embodiment of a magnetic sensor 988 and anamplification circuit and linearizing circuit 992 to provide an outputrepresenting a sensed magnetic field. The amplification and linearizingcircuit may include a single operational amplifier, and the magneticsensor may include a pair of magnetoresistors. FIG. 64 depicts anembodiment of a magnetic sensor 996, an amplification circuit 1000, andlinearizing circuit 1004 to provide a linearized output representing asensed magnetic field. The amplification and linearizing circuits mayeach include an operational amplifier, and the magnetic sensor mayinclude a pair of magnetoresistors. In other embodiments, theamplification circuit to provide an output representing a sensedmagnetic field may include one or more operational transconductanceamplifiers.

The magnetic sensor also may be driven to bias, drive, or modulatesignals of the sensor. FIG. 65 depicts an embodiment of a magneticsensor 1008 and a driver circuit 1012 that may be used to bias, drive ormodulate signals of the magnetic sensor. The magnetic sensor and drivercircuit of FIG. 65 also may be used with embodiments of an amplificationcircuit, such as any of the embodiments of the amplification and/orlinearizing circuits in FIGS. 60-64.

Embodiments of the circuit of the magnetic device may include any subsetor combination of components of any of the circuits discussed herein.For example, the circuit may include one or more components of any ofthe circuits discussed herein. The circuit also may include one or morecomponents of one or more of the circuits discussed herein arranged inany order, such as an order different from that shown in the exemplaryfigures. The circuit also may include components in addition to thecomponents or any subset of components of the circuits discussed herein.

Signals of and between the circuits and subcircuits discussed above maybe either single-ended or differential signals.

The patterned layers discussed herein may be formed as a thin films,such as layers produced by integrated circuit substrate processing.Alternatively, the patterned layers discussed herein may be relativelythick films, such as layers produced by screen printing or other thickfilm processes.

Any feature of any of the embodiments of the magnetic device describedherein can optionally be used in any other embodiment of the magneticdevice. For example, embodiments of the magnetic device may include anycombination of any embodiment of the magnetic structure discussed hereinwith any embodiment of the other device structure discussed herein andany embodiment of the circuit discussed herein. Also, embodiments of themagnetic device can optionally include any subset of the components orfeatures of the magnetic device discussed herein. For example,embodiments of the magnetic device may optionally include anycombination of any embodiment of the magnetic structure discussed hereinwith any embodiment of the other device structure discussed herein,while omitting the circuit.

What is claimed is:
 1. A magnetic module comprising: a patternedmagnetic sensing structure; circuitry arranged to process signalsassociated with the patterned magnetic sensing structure; and anaperture in the magnetic module, the aperture opening to an environmentthat is external to the magnetic module, the aperture being physicallyaligned with the patterned magnetic sensing structure, and the patternedmagnetic sensing structure being arranged to sense magnetic stimuli inthe environment that is external to the magnetic module.
 2. The magneticmodule of claim 1, wherein the aperture exposes at least a portion thepatterned magnetic sensing structure to the environment that is externalto the magnetic module.
 3. The magnetic module of claim 1, wherein theaperture extends through a plurality of substrates.
 4. The magneticmodule of claim 3, wherein the patterned magnetic sensing structure isconnected to at least one of the plurality of substrates at sides of theaperture.
 5. The magnetic module of claim 1, wherein the patternedmagnetic sensing structure is positioned at an interior end of theaperture.
 6. The magnetic module of claim 1, wherein the apertureextends from one side to another side of the magnetic module.
 7. Themagnetic module of claim 1, further comprising two substrates, whereinthe patterned magnetic sensing structure is located between the twosubstrates.
 8. The magnetic module of claim 7, wherein the patternedmagnetic sensing structure is located within a recess in at least one ofthe two substrates.
 9. The magnetic module of claim 1, furthercomprising a second aperture that intersects with the aperture.
 10. Themagnetic module of claim 1, wherein the patterned magnetic sensingstructure and the circuitry are on a common substrate.
 11. The magneticmodule of claim 1, further comprising an antenna.
 12. The magneticmodule of claim 1, further comprising a micromechanical structure. 13.The magnetic module of claim 1, further comprising a cap, wherein thepatterned magnetic sensing structure is on the cap.
 14. The magneticmodule of claim 1, further comprising a cap, wherein the patternedmagnetic sensing structure is partly enclosed by the cap.
 15. A methodof magnetic sensing, the method comprising: sensing, with a patternedmagnetic structure of a magnetic module, a magnetic field external tothe magnetic module, wherein the patterned magnetic structure isphysically aligned with an aperture in the magnetic module, and whereinthe aperture opens to an environment that is external to the module;processing, with circuitry of the magnetic module, an output of thepatterned magnetic sensing structure; and outputting a signalrepresenting the magnetic field sensed by the patterned magneticstructure and processed by the circuitry.
 16. The method of claim 15,wherein the processing comprises digitizing, with the circuitry of themagnetic module, an analog signal representative of the magnetic field.17. The method of claim 15, wherein the outputting comprisestransmitting the signal representing the magnetic field using anantenna.
 18. A magnetic module comprising: means for magnetic sensing;circuitry arranged to process signals associated with the means formagnetic sensing; and an aperture in the magnetic module, the apertureopening to an environment that is external to the magnetic module, theaperture being physically aligned with the means for magnetic sensing,and the means for magnetic sensing being arranged to sense magneticstimuli in the environment that is external to the magnetic module. 19.The magnetic module of claim 18, wherein the aperture extends through aplurality of substrates.
 20. The magnetic module of claim 18, whereinthe means for magnetic sensing and the circuitry are on a commonsubstrate.